Patents by Inventor David L. Gardell
David L. Gardell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11085949Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.Type: GrantFiled: October 18, 2019Date of Patent: August 10, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Dustin Fregeau, David L. Gardell, Peter W. Neff, Frederick H. Roy, III, Grant W. Wagner
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Patent number: 10732202Abstract: A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.Type: GrantFiled: March 29, 2016Date of Patent: August 4, 2020Assignee: GLOBALFOUNDRIES INC.Inventors: Craig M. Bocash, David L. Gardell, Peter W. Neff
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Patent number: 10578648Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.Type: GrantFiled: August 8, 2017Date of Patent: March 3, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Dustin Fregeau, David L. Gardell, Peter W. Neff, Frederick H. Roy, III, Grant W. Wagner
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Patent number: 10571490Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: October 26, 2017Date of Patent: February 25, 2020Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20200049738Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.Type: ApplicationFiled: October 18, 2019Publication date: February 13, 2020Inventors: David M. AUDETTE, Dustin FREGEAU, David L. GARDELL, Peter W. NEFF, Frederick H. ROY, III, Grant W. Wagner
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Patent number: 10514393Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.Type: GrantFiled: March 23, 2018Date of Patent: December 24, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: David L. Gardell, David M. Audette, Peter W. Neff
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Patent number: 10429414Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.Type: GrantFiled: February 2, 2016Date of Patent: October 1, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: Marvin G. L. Montaque, Stephen P. Ayotte, David L. Gardell
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Patent number: 10288645Abstract: An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.Type: GrantFiled: June 30, 2015Date of Patent: May 14, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: David M. Audette, Sukjay J. Chey, Steven A. Cordes, Anthony D. Fortin, David L. Gardell, John R. Maher, Sankeerth Rajalingam, Frederick H. Roy, III
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Patent number: 10041976Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.Type: GrantFiled: February 3, 2016Date of Patent: August 7, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: David L. Gardell, David M. Audette, Peter W. Neff
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Publication number: 20180217184Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.Type: ApplicationFiled: March 23, 2018Publication date: August 2, 2018Inventors: David L. Gardell, David M. Audette, Peter W. Neff
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Publication number: 20180059141Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20170356933Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.Type: ApplicationFiled: August 8, 2017Publication date: December 14, 2017Inventors: David M. AUDETTE, Dustin FREGEAU, David L. GARDELL, Peter W. NEFF, Frederick H. ROY, III, Grant W. Wagner
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Patent number: 9835653Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: May 13, 2014Date of Patent: December 5, 2017Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9797928Abstract: The disclosure describes a probe card assembly for nondestructive integrated circuit testing. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.Type: GrantFiled: September 15, 2014Date of Patent: October 24, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David M. Audette, Dustin Fregeau, David L. Gardell, Peter W. Neff, Frederick H. Roy, III, Grant W. Wagner
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Publication number: 20170285068Abstract: A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.Type: ApplicationFiled: March 29, 2016Publication date: October 5, 2017Applicant: GLOBALFOUNDRIES INC.Inventors: CRAIG M. BOCASH, DAVID L. GARDELL, PETER W. NEFF
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Publication number: 20170219631Abstract: A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.Type: ApplicationFiled: February 2, 2016Publication date: August 3, 2017Inventors: Marvin G. L. Montaque, Stephen P. Ayotte, David L. Gardell
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Publication number: 20170219626Abstract: Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.Type: ApplicationFiled: February 3, 2016Publication date: August 3, 2017Inventors: David L. Gardell, David M. Audette, Peter W. Neff
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Publication number: 20170003318Abstract: An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Inventors: David M. AUDETTE, Sukjay J. CHEY, Steven A. CORDES, Anthony D. FORTIN, David L. GARDELL, John R. MAHER, III, Sankeerth RAJALINGAM, Frederick H. ROY, III
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Publication number: 20160077129Abstract: A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof.Type: ApplicationFiled: September 15, 2014Publication date: March 17, 2016Inventors: David M. AUDETTE, Dustin FREGEAU, David L. GARDELL, Peter W. NEFF, Frederick H. ROY, III, Grant W. Wagner
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Publication number: 20150331014Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: May 13, 2014Publication date: November 19, 2015Applicant: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, JR., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan