Abstract: A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.

Abstract: A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.

Abstract: A container that provides support structure and environmental control means including, for example, minimal contact with a wafer or reticle contained therein that cooperates with wafer or reticle to provide a diffusion barrier mitigates against particles settling on a face of the wafer or reticle. The container includes a base having a flat, polished surface with protrusions upon which the wafer or reticle rests. The protrusions are of a geometry, such as a sphere, that imparts minimum contact with the wafer or reticle and suspends the wafer or reticle over the base, providing a gap therebetween. The gap isolates the wafer or reticle from the flat, polished surface of the base, but is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. Diffusion filters provide pressure equalization without filter media. Moveable reticle pins on the top cover provide reticle restraint.

Abstract: Components, systems, and methods for maintaining an extremely dry environment within substrate containers formed of polymers provides supplemental exterior gas washing of the substrate container to minimize permeation of moisture and oxygen through the polymer walls of the container and to control desorption of water entrapped in the polymer walls of the container.

Abstract: A container that provides support structure and environmental control means including, for example, minimal contact with a wafer or reticle contained therein that cooperates with wafer or reticle to provide a diffusion barrier mitigates against particles settling on a face of the wafer or reticle. The container includes a base having a flat, polished surface with protrusions upon which the wafer or reticle rests. The protrusions are of a geometry, such as a sphere, that imparts minimum contact with the wafer or reticle and suspends the wafer or reticle over the base, providing a gap therebetween. The gap isolates the wafer or reticle from the flat, polished surface of the base, but is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. Diffusion filters provide pressure equalization without filter media. Moveable reticle pins on the top cover provide reticle restraint.

Abstract: A purging station with a substrate container receiving zone having at least one upwardly extending purging nozzle. The nozzle has a circular engaging lip. The substrate container has support means for at least one substrate and a purge port assembly that includes an externally facing sealing flange facing downward from the container. The sealing flange has a central aperture and a cantilevered flange portion that engages with the circular engaging lip of the nozzle. The weight of the substrate container on the nozzle carried by the canilevered portion of the flange causes bending of the flange for a resilient soft seal.

Abstract: The present invention provides a standardized mechanical interface (SMIF) reticle pod that is configured to provide a controlled environment for supporting a reticle wherein the controlled environment is maintained substantially free of crystal growth causing contaminants. Accordingly, there is provided a layered filter with filter elements capable of filtering particulates and adsorbing gaseous contaminants. The filter has an inwardly facing face generally planar shaped with a surface area that is substantially half or more of the area of the reticle face. The inwardly facing face is placed in close proximity to the reticle patterned surface and has an area that is a significant fraction of the reticle patterned surface area. The SMIF pod is also provided with a purge system configured to inject a very dry gas within the controlled environment to flush the controlled environment of contaminants as well as to regenerate the filter.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A substrate container includes an enclosure and an access structure formed in the enclosure and providing fluid access through the enclosure to an interior of the substrate container. The access structure includes an opening and an inner surface. A grommet is situated against the inner surface of the access structure.

Abstract: A substrate container having an enclosure with an access opening for inserting and removing substrates into an interior of the enclosure and a door chassis that is configured to selectively enclose the opening, the door chassis comprising a first wall having a peripheral wall extending therefrom. The substrate container includes a latch mechanism that is operably coupled with the chassis, the latch mechanism configured to operably secure the chassis to the opening. The door of the substrate container includes a textured particle capture region wherein particles generated by the latch mechanism and elsewhere are captured by the particle capture region.

Abstract: A semi-conductor handling equipment cleaning method and apparatus are configured for use with wafer carriers. The cleaning apparatus comprises a base portion having first and second apertures and configured to support the wafer carrier in sealing contact about the first aperture. A first fluidic circuit introduces a first cleaning fluid to the inner surface of the carrier and a second fluidic circuit introduces a second cleaning fluid to the outer surface of the carrier. The carrier forms a barrier with the base so that the cleaning media is isolated so as to substantially prevent the second fluid from communicating with the first fluid. An optional door cleaning assembly comprises a rotational housing, a shaft disposed in the housing and a door receiving assembly rotatably disposed on the shaft and within the housing and securably receives the door and forms a fluid-tight seal between the door and the door receiving assembly.

Abstract: The present invention is directed to a semi-conductor handling equipment cleaning apparatus configured for use with wafer carriers. The base of the cleaning apparatus is configured to support the wafer carrier in sealing contact about a first aperture. A first fluidic circuit is provided for introducing a first cleaning fluid to the inner surface of the carrier. A second fluidic circuit is provided for introducing a second cleaning fluid to the outer surface of the carrier. The carrier forms a barrier with the base so that the cleaning media is isolated so as to substantially prevent the second fluid used to clean the exterior from communicating with the first fluid used to clean the interior of the carrier.

Abstract: The present invention is directed to a semi-conductor handling equipment cleaning method and apparatus configured for use with wafer carriers. The cleaning apparatus comprises a base portion having a first aperture and a second aperture. The base is configured to support the wafer carrier in sealing contact about the first aperture. A first fluidic circuit is provided for introducing a first cleaning fluid to the inner surface of the carrier. A second fluidic circuit is provided for introducing a second cleaning fluid to the outer surface of the carrier. The carrier forms a barrier with the base so that the cleaning media is isolated so as to substantially prevent the second fluid used to clean the exterior from communicating with the first fluid used to clean the interior of the carrier. A door cleaning assembly may be provided as part of the cleaning apparatus.

Abstract: The present invention is directed to a semi-conductor handling equipment cleaning method and apparatus configured for use with wafer carriers. The cleaning apparatus comprises a base portion having a first aperture and a second aperture. The base is configured to support the wafer carrier in sealing contact about the first aperture. A first fluidic circuit is provided for introducing a first cleaning fluid to the inner surface of the carrier. A second fluidic circuit is provided for introducing a second cleaning fluid to the outer surface of the carrier. The carrier forms a barrier with the base so that the cleaning media is isolated so as to substantially prevent the second fluid used to clean the exterior from communicating with the first fluid used to clean the interior of the carrier.

Abstract: A method of cleaning a wafer carrier utilizes two isolated fluidic circuits. The wafer carrier having an interior and an exterior. The carrier is sealingly attached to a cleaning apparatus having separate isolated areas, one isolated area including the interior and the other the exterior. Fluid of the first fluidic circuit is sprayed on the interior and fluid from the second circuit is sprayed on the exterior reducing cross contamination.