Abstract: An improved resistance-type sensor for an electrical temperature probe includes a thin-film platinum resistor deposited on an oxidized silicon chip. The chip is eutectically bonded to the planar reverse side of a beryllium oxide tip-piece having a hemispherical face adapted for contacting the surface of an object being measured. The tip-piece is set in a thermal insulating plastic mount, spaced from a pair of low resistance electrical leads held by the mount. Very fine wires bonded between the leads and platinum resistor form high thermal impedance electrical connections to the temperature-sensing element.