Patents by Inventor David Lam
David Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8912835Abstract: A method for controlling pulsed power that includes measuring a first pulse of power from a power amplifier to obtain data. The method also includes generating a first signal to adjust a second pulse of delivered power, the first signal correlated to the data to minimize a power difference between a power set point and a substantially stable portion of the second pulse. The method also includes generating a second signal to adjust the second pulse of delivered power, the second signal correlated to the data to minimize an amplitude difference between a peak of the second pulse and the substantially stable portion of the second pulse.Type: GrantFiled: January 9, 2014Date of Patent: December 16, 2014Assignee: MKS Instruments Inc.Inventors: Siddarth Nagarkatti, Feng Tian, David Lam, Abdul Rashid, Souheil Benzerrouk, Ilya Bystryak, David Menzer, Jack J. Schuss, Jesse E. Ambrosina
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Publication number: 20140262746Abstract: An apparatus for abatement of gases is provided. The apparatus includes a toroidal plasma chamber having a plurality of inlets and an outlet, and at least one chamber wall. One or more magnetic cores are disposed relative to the toroidal plasma chamber. The plasma chamber confines a toroidal plasma. A second gas inlet is positioned on the toroidal plasma chamber between a first gas inlet and the gas outlet at a distance d from the gas outlet, such that a toroidal plasma channel volume between the first gas inlet and the second gas inlet in the is substantially filled by the inert gas, the distance d based on a desired residence time of the gas to be abated.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Applicant: MKS Instruments, Inc.Inventors: Xing Chen, IIya Pokidov, Arthur Tian, Ken Tran, David Lam, Kevin W. Wenzel
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Patent number: 8759965Abstract: A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.Type: GrantFiled: October 13, 2010Date of Patent: June 24, 2014Assignees: STMicroelectronics, Inc., RJR Polymers, Inc.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Patent number: 8659335Abstract: A method for controlling pulsed power that includes measuring a first pulse of power from a power amplifier to obtain data. The method also includes generating a first signal to adjust a second pulse of delivered power, the first signal correlated to the data to minimize a power difference between a power set point and a substantially stable portion of the second pulse. The method also includes generating a second signal to adjust the second pulse of delivered power, the second signal correlated to the data to minimize an amplitude difference between a peak of the second pulse and the substantially stable portion of the second pulse.Type: GrantFiled: June 25, 2009Date of Patent: February 25, 2014Assignee: MKS Instruments, Inc.Inventors: Siddharth Nagarkatti, Feng Tian, David Lam, Abdul Rashid, Souheil Benzerrouk, Ilya Bystryak, David Menzer, Jack J. Schuss, Jesse E. Ambrosina
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Patent number: 8639373Abstract: A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assemblType: GrantFiled: October 13, 2010Date of Patent: January 28, 2014Assignees: STMicroelectronics, Inc., RJR Polymers, Inc.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Patent number: 8573427Abstract: A collapsible crate for transporting goods, the crate having an upstanding wall, at least a portion of which is movable, locating feature and releasable locking feature for releasably securing the movable wall portion relative to the crate, wherein the locating feature has a projection receivable within a recess or aperture to align, in use, the movable wall portion relative to the crate such that the movable wall portion is releasably securable by the locking feature.Type: GrantFiled: February 13, 2009Date of Patent: November 5, 2013Assignee: Goodpack LimitedInventor: David Lam
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Patent number: 8560104Abstract: A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing asseType: GrantFiled: October 13, 2010Date of Patent: October 15, 2013Assignees: STMicroelectronics, Inc., RJR Polymers, Inc.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Patent number: 8557551Abstract: The invention provides novel methods for making or modifying oils, e.g., plant, animal or microbial oils, such as vegetable oils or related compounds, that are low in a particular fatty acid(s), for example, low linoleic oils, low linolenic oils, low palmitic oils, low stearic oils or oils low in a combination thereof.Type: GrantFiled: September 9, 2005Date of Patent: October 15, 2013Assignee: DSM IP Assets B.V.Inventors: David Lam, David Weiner, Timothy Hitchman, Nelson R. Barton, Jonathan Lyon
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Patent number: 8283769Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.Type: GrantFiled: October 13, 2010Date of Patent: October 9, 2012Assignee: STMicroelectronics, Inc.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20120100581Abstract: The invention provides novel polypeptides having phospholipase activity, including, e.g., phospholipase A, B, C and D activity, patatin activity, phosphatidic acid phosphatases (PAP)) and/or lipid acyl hydrolase (LAH) activity, nucleic acids encoding them and antibodies that bind to them. Industrial methods, e.g., oil degumming, and products comprising use of these phospholipases are also provided.Type: ApplicationFiled: April 20, 2011Publication date: April 26, 2012Applicant: VERENIUM CORPORATIONInventors: SVETLANA GRAMATIKOVA, GEOFF HAZLEWOOD, DAVID LAM, NELSON R. BARTON, BLAKE G. STURGIS, DAN E. ROBERTSON, JINCAI LI, JOEL A. KREPS, RODERICK JAMES FIELDING, ROBERT C. BROWN, AMIT VASAVADA, XUQIU TAN, ADRIAN BADILLO, WILHELMUS P. VAN HOEK, GISELLE JANSSEN, CHARLES ISAAC, MARK J. BURK
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Patent number: 8153474Abstract: A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.Type: GrantFiled: October 13, 2010Date of Patent: April 10, 2012Assignee: STMicroelectronics, Inc.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20110306117Abstract: The invention provides the invention provides compositions and methods for the enzymatic treatment (“bleaching” or “de-colorizing”) of chlorophyll-comprising compositions, e.g., algae preparations, chlorophyll-containing or chlorophyll-contaminated feeds, foods or oils, for example, vegetable oils, including oils processed from oilseeds, such as canola (rapeseed) oil or soybean oil, or oil fruits, such as palm oil. In one aspect, the invention provides methods using a chlorophyllase enzyme for the enzymatic hydrolysis of chlorophyll in an algae, an animal (e.g., a fish) or plant preparation, a food or an oil. In one aspect, the chlorophyllase is immobilized onto a silica. The invention also provides compositions of manufacture and detergents.Type: ApplicationFiled: May 9, 2011Publication date: December 15, 2011Applicant: VERENIUM CORPORATIONInventors: DAVID LAM, DAVID WEINER, TIMOTHY HITCHMAN, NELSON BARTON, MARK BURK
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Patent number: 7977080Abstract: The invention provides novel polypeptides having phospholipase activity, including, e.g., phospholipase A, B, C and D activity, patatin activity, phosphatidic acid phosphatases (PAP)) and/or lipid acyl hydrolase (LAH) activity, nucleic acids encoding them and antibodies that bind to them. Industrial methods, e.g., oil degumming, and products comprising use of these phospholipases are also provided.Type: GrantFiled: March 8, 2005Date of Patent: July 12, 2011Assignee: Verenium CorporationInventors: Svetlana Gramatikova, Geoff Hazlewood, David Lam, Nelson R. Barton, Blake G. Sturgis, Dan E. Robertson, Jincai Li, Joel A. Kreps, Roderick James Fielding, Robert C. Brown, Amit Vasavada, Xuqiu Tan, Adrian Badillo, Wilhelmus P. Van Hoek, Giselle Janssen, Charles Isaac, Mark J. Burk
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Patent number: 7943360Abstract: The invention provides novel polypeptides having phospholipase activity, including, e.g., phospholipase A, B, C and D activity, patatin activity, lipid acyl hydrolase (LAH) activity, nucleic acids encoding them and antibodies that bind to them. Industrial methods, e.g., oil degumming, and products comprising use of these phospholipases are also provided.Type: GrantFiled: January 22, 2007Date of Patent: May 17, 2011Assignee: Verenium CorporationInventors: Svetlana Gramatikova, Geoff Hazlewood, David Lam, Nelson R. Barton, Blake G. Sturgis, Dan E. Robertson, Jincai Li, Joel A. Kreps, Roderick James Fielding, Robert C. Brown, Amit Vasavada, Xuqiu Tan, Adrian Badillo, Wilhelmus P. Van Hoek, Giselle Janssen, Charles Isaac, Mark J. Burk
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Publication number: 20110086469Abstract: A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.Type: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicants: STMICROELECTRONICS, INC., RJR POLYMERS, INC.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20110087356Abstract: A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assemblType: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicants: STMICROELECTRONICS, INC., RJR POLYMERS, INC.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20110087353Abstract: A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing asseType: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicants: STMICROELECTRONICS, INC., RJR POLYMERS, INC.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20110084371Abstract: A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.Type: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicants: STMICROELECTRONICS, INC., RJR POLYMERS, INC.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20110084376Abstract: A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.Type: ApplicationFiled: October 13, 2010Publication date: April 14, 2011Applicants: STMICROELECTRONICS, INC., RJR POLYMERS, INC.Inventors: Craig J. Rotay, John Ni, David Lam, David Lee DeWire, John W. Roman, Richard J. Ross
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Publication number: 20100327927Abstract: A method for controlling pulsed power that includes measuring a first pulse of power from a power amplifier to obtain data. The method also includes generating a first signal to adjust a second pulse of delivered power, the first signal correlated to the data to minimize a power difference between a power set point and a substantially stable portion of the second pulse. The method also includes generating a second signal to adjust the second pulse of delivered power, the second signal correlated to the data to minimize an amplitude difference between a peak of the second pulse and the substantially stable portion of the second pulse.Type: ApplicationFiled: June 25, 2009Publication date: December 30, 2010Applicant: MKS Instruments, Inc.Inventors: Siddharth Nagarkatti, Feng Tian, David Lam, Abdul Rashid, Souheil Benzerrouk, Ilya Bystryak, David Menzer, Jack J. Schuss, Jesse E. Ambrosina