Abstract: A distributed storage system for the long-term storage of data objects that is implemented utilizing one or more distinct storage sites that may be comprised of system controllers and object storage systems that act in concert to embody a single distributed storage system. A system may include a one or more types and/or instances of object storage systems in which replicas of objects are stored in at least two of the said object storage systems. A system may further include system controllers associated with logical and/or physical sites that coordinate object, user, device, and system management functionally.

Abstract: A system and method to render inoperable electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

Abstract: A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of thermally conductive plastic that combine to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

Abstract: A system and method to render inoperable electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: An system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel.

Abstract: A system and method for cooling electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with the inner volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The inner volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with the inner volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The inner volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with the innermost volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of thermally conductive plastic that combine to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

Abstract: A system and method for cooling electronic devices disposed with the innermost volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with the innermost volume of a hollow-walled fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes within the hollow walls of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase dielectric thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in the innermost volume of the sealed container.

Abstract: A system and method for cooling electronic devices disposed with the innermost volume of a hollow-walled fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes within the hollow walls of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The innermost volume of the sealed container contains one or more single phase or multi-phase dielectric thermally conductive fluids, which may be circulated passively by convection or actively by means of a pump, bubbler, fan, propeller or other means. Pressure balancing mechanisms may be included to maintain suitable pressure of gaseous fluid in the innermost volume of the sealed container.