Abstract: In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.

Abstract: In one embodiment, an X-ray inspection system may capture one or more X-ray images for samples of interest processed by a first tool. The X-ray inspection system may be inline with the first tool and have an inspection speed of 300 mm2 per minute or greater. The system may determine, in real-time, metrology information related to the samples of interest based on the X-ray images. The metrology information may indicate that a sample parameter associated with the samples of interest is outside of a pre-determined range. The system may provide instructions or data to one or more of the first tool or one or more second tools to adjust process parameters associated with the respective tools based on metrology information. The adjusted process parameters may reduce a processing error probability, of the respective tool for processing subsequent samples, related to the sample parameter being outside of the pre-determined range.

Abstract: In one embodiment, an automated high-speed X-ray inspection tool may emit, by an X-ray source, an X-ray beam to an object of interest with a portion of the X-ray beam penetrating through the object of interest. The automated high-speed X-ray inspection tool may capture, by an X-ray sensor, one or more X-ray images of the object of interest based on the portion of the X-ray beam that penetrates through the object of interest. Each of the X-ray images may be captured with a field of view of at least 12 million pixels.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a first manufacturing process. The system may analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process. The system may automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model.

Abstract: In one embodiment, an automated high-speed X-ray inspection system may identify reference objects for an object of interest to be inspected. Each reference object may have a same type and components as the object of interest. The system may generate a reference model for the object of interest based on X-ray images of the reference objects. The system may determine whether the object of interest is associated with one or more defects by comparing an X-ray image of the object of interest to the reference model. The defects may be characterized by one or more pre-determined defect models and may be classified into respective defect categories based on the pre-determined defect models.

Abstract: In one embodiment, an X-ray inspection system may capture one or more X-ray images for samples of interest processed by a first tool. The X-ray inspection system may be inline with the first tool and have an inspection speed of 300 mm2 per minute or greater. The system may determine, in real-time, metrology information related to the samples of interest based on the X-ray images. The metrology information may indicate that a sample parameter associated with the samples of interest is outside of a pre-determined range. The system may provide instructions or data to one or more of the first tool or one or more second tools to adjust process parameters associated with the respective tools based on metrology information. The adjusted process parameters may reduce a processing error probability, of the respective tool for processing subsequent samples, related to the sample parameter being outside of the pre-determined range.

Abstract: In one embodiment, an X-ray inspection system may access a first set of X-ray images of one or more first samples that are labeled as being non-conforming. The system may adjust a classification algorithm based on the first set of X-ray images. The classification algorithm may classify samples into conforming or non-conforming categories based on an analysis of corresponding X-ray images. The system may analyze a second set of X-ray images of a number of second samples using the adjusted classification algorithm. The second samples may be previously inspected samples that have been classified as conforming by the classification algorithm during a previous analysis before the classification algorithm is adjusted. The system may identify one or more of the second samples from the second set of X-ray images. Each identified second sample may be classified as non-conforming by the adjusted classification algorithm.

Abstract: In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.

Abstract: In one embodiment, a computing system may access design data of a printed circuit board to be produced by a first manufacturing process. The system may analyze the design data of the printed circuit board using a machine-learning model, wherein the machine-learning model is trained based on X-ray inspection data associated with the first manufacturing process. The system may automatically determine one or more corrections for the design data of the printed circuit board based on the analysis result by the machine-learning model.

Abstract: In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

Abstract: Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: Objects undergoing processing by a high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from an extended source having a designated x-ray spectrum. The system also comprises a stage to control the position and orientation of the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: A high resolution x-ray microscope with a high flux x-ray source that allows high speed metrology or inspection of objects such as integrated circuits (ICs), printed circuit boards (PCBs), and other IC packaging technologies. The object to be investigated is illuminated by collimated, high-flux x-rays from a movable, extended source having a designated x-ray spectrum. The system also comprises a means to control the relative positions of the x-ray source and the object; a scintillator that absorbs x-rays and emits visible photons positioned in very close proximity to (or in contact with) the object; an optical imaging system that forms a highly magnified, high-resolution image of the photons emitted by the scintillator; and a detector such as a CCD array to convert the image to electronic signals.

Abstract: An apparatus is disclosed for the examination and inspection of integrated devices such as integrated circuits. X-rays are transmitted through the integrated device, and are incident on a photoemissive structure that absorbs x-rays and emits electrons. The electrons emitted by the photoemissive structure are shaped by an electron optical system to form a magnified image of the emitted electrons on a detector. This magnified image is then recorded and processed. For some embodiments of the invention, the photoemissive structure is deposited directly onto the integrated device. In some embodiments, the incidence angle of the x-rays is varied to allow internal three-dimensional structures of the integrated device to be determined. In other embodiments, the recorded image is compared with a reference data to enable inspection for manufacturing quality control.