Abstract: An apparatus to test an integrated circuit has a plurality of contact pads electrically coupled to the integrated circuit to transfer electrical signals to and from the integrated circuit. The apparatus comprises a ring and a plurality of probes. The ring has a ring surface and an opening to a hollow cavity extending through the ring. The ring surface substantially surrounds the opening. The ring has at least one structural reference point affixed thereto, which is offset a known distance and a known direction from the plurality of contact pads. The plurality of probes are positioned on the ring surface extending from a first location exterior to the ring to a second location proximate to the opening.

Abstract: An apparatus to test an integrated circuit has a plurality of contact pads electrically coupled to the integrated circuit to transfer electrical signals to and from the integrated circuit. The apparatus has a body or ring, a plurality of probes, and electrical components. The ring has a ring surface and a ring opening in the ring surface to a hollow cavity extending through the ring. The plurality of probes extend from a first location exterior of the ring to a second location over the ring opening and are affixed to the ring with an adhesive. Each probe of the plurality of probes has a contact end to electrically contact one contact pad of the plurality of contact pads. In some embodiments, at least one electrical component is secured to the ring. The at least one electrical component is electrically coupled to the plurality of contact pads. A conductive plate may also be secured to the body and be electrically coupled to at least probe of the plurality of probes and to the at least one electrical component.