Patents by Inventor David Malcolm Camm
David Malcolm Camm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6963692Abstract: A method involves increasing a temperature of a workpiece over a first time period to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, the heating commencing within less time following the first time period than the first time period. Another method involves pre-heating the workpiece from an initial temperature to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature by an amount less than or equal to about one-fifth of a difference between the intermediate and initial temperatures. Another method involves irradiating a first side of the workpiece to pre-heat the workpiece to an intermediate temperature, and irradiating a second side of the workpiece to heat the second side to a desired temperature greater than the intermediate temperature.Type: GrantFiled: April 30, 2003Date of Patent: November 8, 2005Assignee: Vortek Industries Ltd.Inventors: David Malcolm Camm, J. Kiefer Elliot
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Patent number: 6941063Abstract: A method involves pre-heating a workpiece to an intermediate temperature, heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, and enhancing cooling of the workpiece. Enhancing cooling may involve absorbing radiation thermally emitted by the workpiece. An apparatus includes a first heating source for heating a first surface of a semiconductor wafer, a second heating source for heating a second surface of the semiconductor wafer, and a first cooled window disposed between the first heating source and the semiconductor wafer.Type: GrantFiled: December 4, 2001Date of Patent: September 6, 2005Assignee: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, J. Kiefer Elliott
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Publication number: 20040178553Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.Type: ApplicationFiled: December 19, 2003Publication date: September 16, 2004Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Publication number: 20030206732Abstract: Methods and systems for heat-treating a workpiece are disclosed. One method involves increasing a temperature of the workpiece over a first time period to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, the heating commencing within less time following the first time period than the first time period. Another method involves pre-heating the workpiece from an initial temperature to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature by an amount less than or equal to about one-fifth of a difference between the intermediate and initial temperatures. Another method involves irradiating a first side of the workpiece to pre-heat the workpiece to an intermediate temperature, and irradiating a second side of the workpiece to heat the second side to a desired temperature greater than the intermediate temperature.Type: ApplicationFiled: April 30, 2003Publication date: November 6, 2003Inventors: David Malcolm Camm, J. Kiefer Elliott
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Patent number: 6621199Abstract: A method and apparatus for producing high intensity electromagnetic radiation are disclosed. The apparatus includes a high intensity arc lamp having an inner envelope cooled by a first flow of liquid along an inside surface of the inner envelope. The arc lamp includes first and second electrodes for generating a high power plasma arc within the inner envelope, the arc emitting the radiation. The apparatus further includes a cooling device for producing a second flow of liquid in contact with an outside surface of the inner envelope. In order to approximate a desired electromagnetic radiation spectrum, the apparatus may further include an energy redistributor for redistributing energy within a first radiation spectrum generated by the arc to produce a second radiation spectrum.Type: GrantFiled: January 21, 2000Date of Patent: September 16, 2003Assignees: Vortek Industries Ltd., Vortex Industries Ltd.Inventors: Dean Allister Parfeniuk, David Malcolm Camm, Johan George Fourie, Roger Housden, Arne Kjørvel, Steven McCoy, Sujay Prasad, Tilman Jochen Thrum
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Patent number: 6594446Abstract: Methods and systems for heat-treating a workpiece are disclosed. A first method involves increasing a temperature of the workpiece over a first time period to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, the heating commencing within less time following the first time period than the first time period. A second method involves pre-heating the workpiece from an initial temperature to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature by an amount less than or equal to about one-fifth of a difference between the intermediate and initial temperatures. A third method involves irradiating a first side of the workpiece to pre-heat the workpiece to an intermediate temperature, and irradiating a second side of the workpiece to heat the second side to a desired temperature greater than the intermediate temperature.Type: GrantFiled: December 4, 2000Date of Patent: July 15, 2003Assignee: Vortek Industries Ltd.Inventors: David Malcolm Camm, J. Kiefer Elliott
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Patent number: 6534752Abstract: A method, apparatus and system for producing a desired spatial temperature distribution across a workpiece. The method includes irradiating a plurality of areas on a surface of the workpiece to create localized heating of the workpiece in those areas, to produce the desired spatial temperature distribution in the workpiece, and the apparatus includes means for carrying out the method. The system includes a locator for locating the workpiece in a desired position relative to an energy source, and an irradiance system for carrying out the method. The system further includes a processor circuit in communication with the irradiance system, and a radiation-absorbing environment. The irradiance system includes a measuring system and at least one energy source for directing radiation to the surface of the workpiece.Type: GrantFiled: June 12, 2001Date of Patent: March 18, 2003Assignee: Vortek Industries Ltd.Inventors: David Malcolm Camm, Marcel Edmond Lefrancois, Brendon James Hickson
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Publication number: 20020102098Abstract: Methods and systems for heat-treating a workpiece are disclosed. One such method involves pre-heating the workpiece to an intermediate temperature, heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, and enhancing cooling of the workpiece. Enhancing cooling may involve absorbing radiation thermally emitted by the workpiece. Semiconductor heating methods and apparatuses are also disclosed. One such apparatus includes a first heating source for heating a first surface of a semiconductor wafer, a second heating source for heating a second surface of the semiconductor wafer, and a first cooled window disposed between the first heating source and the semiconductor wafer.Type: ApplicationFiled: December 4, 2001Publication date: August 1, 2002Inventors: David Malcolm Camm, J. Kiefer Elliott
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Publication number: 20020067918Abstract: Methods and systems for heat-treating a workpiece are disclosed. A first method involves increasing a temperature of the workpiece over a first time period to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature, the heating commencing within less time following the first time period than the first time period. A second method involves pre-heating the workpiece from an initial temperature to an intermediate temperature, and heating a surface of the workpiece to a desired temperature greater than the intermediate temperature by an amount less than or equal to about one-fifth of a difference between the intermediate and initial temperatures. A third method involves irradiating a first side of the workpiece to pre-heat the workpiece to an intermediate temperature, and irradiating a second side of the workpiece to heat the second side to a desired temperature greater than the intermediate temperature.Type: ApplicationFiled: December 4, 2000Publication date: June 6, 2002Inventors: David Malcolm Camm, J. Kiefer Elliott
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Publication number: 20010036219Abstract: A method, apparatus and system for producing a desired spatial temperature distribution across a workpiece. The method includes irradiating a plurality of areas on a surface of the workpiece to create localized heating of the workpiece in those areas, to produce the desired spatial temperature distribution in the workpiece, and the apparatus includes means for carrying out the method. The system includes a locator for locating the workpiece in a desired position relative to an energy source, and an irradiance system for carrying out the method. The system further includes a processor circuit in communication with the irradiance system, and a radiation-absorbing environment. The irradiance system includes a measuring system and at least one energy source for directing radiation to the surface of the workpiece.Type: ApplicationFiled: June 12, 2001Publication date: November 1, 2001Inventors: David Malcolm Camm, Marcel Edmond Lefrancois, Brendon James Hickson
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Patent number: 6303411Abstract: A method, apparatus and system for producing a desired spatial temperature distribution across a workpiece. The method includes irradiating a plurality of areas on a surface of the workpiece to create localized heating of the workpiece in those areas, to produce the desired spatial temperature distribution in the workpiece, and the apparatus includes means for carrying out the method. The system includes a locator for locating the workpiece in a desired position relative to an energy source, and an irradiance system for carrying out the method. The system further includes a processor circuit in communication with the irradiance system, and a radiation-absorbing environment. The irradiance system includes a measuring system and at least one energy source for directing radiation to the surface of the workpiece.Type: GrantFiled: May 3, 1999Date of Patent: October 16, 2001Assignee: Vortek Industries Ltd.Inventors: David Malcolm Camm, Marcel Edmond Lefrancois, Brendon James Hickson