Patents by Inventor David Max Roundhill

David Max Roundhill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METALLIC INK
    Publication number: 20090274833
    Abstract: A metallic ink including a vehicle, a multiplicity of copper nanoparticles, and an alcohol. The conductive metallic ink may be deposited on a substrate by methods including inkjet printing and draw-down printing. The ink may be pre-cured and cured to form a conductor on the substrate.
    Type: Application
    Filed: March 31, 2009
    Publication date: November 5, 2009
    Applicants: Ishihara Chemical Co., Ltd., Applied Nanotech Holdings, Inc.
    Inventors: Yunjun Li, David Max Roundhill, Xueping Li, Peter B. Laxton, Hidetoshi Arimura, Zvi Yaniv
  • ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDUCTIVE INKS
    Publication number: 20090242854
    Abstract: A conductive ink includes metallic nanoparticles, a polymeric dispersant, and a solvent. The polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants. The solvent may include water, an organic solvent, or any combination thereof. The conductive ink may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof.
    Type: Application
    Filed: February 24, 2009
    Publication date: October 1, 2009
    Applicants: Applied Nanotech Holdings, Inc., Ishihara Chemical Co., Ltd.
    Inventors: Xueping Li, Yunjun Li, Peter B. Laxton, David Max Roundhill, Hidetoshi Arimura
  • METALLIC INK
    Publication number: 20080286488
    Abstract: Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Applicant: Nano-Proprietary, Inc.
    Inventors: Yunjun Li, David Max Roundhill, Mohshi Yang, Igor Pavlovsky, Richard Lee Fink, Zvi Yaniv