Abstract: A semiconductor optical apparatus is disclosed, wherein the semiconductor optical apparatus comprises a first waveguide region defining a first mode size and a second active waveguide region defining a second mode size being smaller than the first mode size. The second active waveguide region is optically coupled to the first waveguide region and the second active waveguide region comprises a lower multiple quantum well layer and an upper multiple quantum well layer located above the lower multiple quantum well layer. The lower multiple quantum well layer is physically separated from the upper multiple quantum well layer by a spacer layer. The upper multiple quantum well layer comprises a mode transformation region configured to reduce the size of an optical mode from the first mode size to the second mode size.

Abstract: A semiconductor optical apparatus is disclosed, wherein the semiconductor optical apparatus comprises a first waveguide region defining a first mode size and a second active waveguide region defining a second mode size being smaller than the first mode size. The second active waveguide region is optically coupled to the first waveguide region and the second active waveguide region comprises a lower multiple quantum well layer and an upper multiple quantum well layer located above the lower multiple quantum well layer. The lower multiple quantum well layer is physically separated from the upper multiple quantum well layer by a spacer layer. The upper multiple quantum well layer comprises a mode transformation region configured to reduce the size of an optical mode from the first mode size to the second mode size.

Abstract: A cookware assembly or set comprising or including at least one cookware vessel of a substantially square peripheral exterior and interior form when viewed in plan, wherein the vessel has an attachment location on at least one of the four sides, the attachment location being a relief in the vessel's rim suitable for handle engagement, and a handle selectively engageable at the or any one of the attachment locations, the handle with both proximal and distal end regions having a pair of jaw elements at the proximal region for facilitating engagement to an attachment location such that a first jaw of the jaw pair locates substantially inside the vessel and a second jaw of the jaw pair locates substantially outside of the vessel, and a lid able to fit on the cookware vessel and to close, or at least substantially close, the cookware vessel.

Abstract: A cookware assembly or set comprising or including at least one cookware vessel of a substantially square peripheral exterior and interior form when viewed in plan, wherein the vessel has an attachment location on at least one of the four sides, the attachment location being a relief in the vessel's rim suitable for handle engagement, and a handle selectively engageable at the or any one of the attachment locations, the handle with both proximal and distal end regions having a pair of jaw elements at the proximal region for facilitating engagement to an attachment location such that a first jaw of the jaw pair locates substantially inside the vessel and a second jaw of the jaw pair locates substantially outside of the vessel, and a lid able to fit on the cookware vessel and to close, or at least substantially close, the cookware vessel.

Abstract: A cookware assembly or set comprising or including at least one cookware vessel of a substantially square peripheral exterior and interior form when viewed in plan, wherein the vessel has an attachment location on at least one of the four sides, the attachment location being a relief in the vessel's rim suitable for handle engagement, and a handle selectively engageable at the or any one of the attachment locations, the handle with both proximal and distal end regions having a pair of jaw elements at the proximal region for facilitating engagement to an attachment location such that a first jaw of the jaw pair locates substantially inside the vessel and a second jaw of the jaw pair locates substantially outside of the vessel, and a lid able to fit on the cookware vessel and to close, or at least substantially close, the cookware vessel.

Abstract: An electroabsorption modulator comprises an absorption layer (1) between two layers of n-doped semiconductor (2, 5). The absorption layer (1) is doped or implanted with Fe ions making it semi-insulating. The use of an NiN structure rather than a PiN structure significantly reduces the series resistance of the device. The Fe doping of the absorption layer reduces the leakage current of the NiN structure and provides recombination sites for photo-generated electron-hole airs.