Patents by Inventor David Nevo

David Nevo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9232631
    Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: January 5, 2016
    Assignees: Thales, Centre National D'Etudes Spatiales
    Inventors: Olivier Vendier, David Nevo, Antoine Renel, Beatrice Espana
  • Publication number: 20150181694
    Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 25, 2015
    Inventors: Olivier VENDIER, David NEVO, Antoine RENEL, Beatrice ESPANA
  • Publication number: 20120152612
    Abstract: A signal transfer device which can be used to transfer a signal through a wall of a power package including a base, the wall bounding an internal part and an external part, said device including a first signal line portion outside the package; a second signal line portion inside the package; and a third signal line portion connecting the other two portions, wherein the first portion is shifted from the wall so as to respect a predefined safety distance; and the third portion is buried over its entire length.
    Type: Application
    Filed: September 2, 2010
    Publication date: June 21, 2012
    Applicant: THALES
    Inventors: Claude Drevon, Olivier Vendier, David Nevo
  • Publication number: 20120098617
    Abstract: A Wilkinson coupler mounted on a printed circuit comprises a first access port connected to a second access port and to a third access port by way of two metallic transmission lines of the same length and a load resistor mounted in short-circuit arrangement between the second and third access ports, characterized in that the load resistor is constituted of three adjacent independent resistors linked together. The coupler applies notably to the field of satellite antennas and more particularly to antenna beamforming arrays.
    Type: Application
    Filed: June 21, 2010
    Publication date: April 26, 2012
    Applicant: THALES
    Inventors: Claude Drevon, David Nevo, Laurent Bodin