Abstract: A deposing ring and cover ring for extending process components life and performance for process chambers are disclosed. A deposition ring including a protruding surface is positioned in spaced apart relation with a cover ring including a depressed surface. Indicated surfaces of the deposition ring and cover ring may be covered with a coating to improve adhesion of deposited materials.

Abstract: A pressurized container for transporting cleaned semiconductor processing equipment wherein a shell of static-free material is provided with a central pedestal covered by a deformable pad and a number of vertical stops and shoulders spaced therefrom. The equipment is clamped in place on the stops and pedestal and a cover positioned on the shell. The shell contains input and output ports to permit a gaseous purge followed by a closing of the output port to build pressure in the container followed by closure of the input port to provide a positive pressure in the container.

Abstract: A method for removing deposited material from vacuum deposition equipment is disclosed. The method utilizes a low temperature bath, between 40-50 degrees F., to strip sputter depositions, followed by an acid etch step using a low concentration of hydrofluoride acid to remove trace contamination from the surface. Following removal of deposited material, surface texturing of the components is provided.

Abstract: An ultrasonic immersion cleaning tank is constructed to serve as a pass-through between a processing environment and a clean room. The tank is sited as the entryway into a bounded clean room. Particle barriers and positive pressure are utilized to reduce entry of contaminants into the clean room. The components after cleaning are withdrawn from the tank directly into the clean room environment thereby greatly reducing surface contamination thereof.