Abstract: An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sensor projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sensor projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sensor associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sensor are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon.