Patents by Inventor David Paul Vallett

David Paul Vallett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Using time resolved light emission from VLSI circuit devices for navigation on complex systems
    Patent number: 6650768
    Abstract: A system and method for determining the location of a particular device on an integrated circuit chip is described. The system and method utilize apparatus for detecting the emission of light during switching events of devices in the circuit during the circuit's processing of an input calculated to actuate the device whose location is desired. Light emissions from the circuit can be temporally and spatially indexed so as to allow deduction, in combination with the a priori knowledge of the logical operation of the circuit, of the location of the desired element. In another embodiment of the invention, a series of images of the circuit can be accumulated, representing the circuit's response to a series of different input signals, each input signal being designed to result in the switching of the desired element. The series of images can be compared to determine the location of the desired element.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: November 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard James Evans, Jeffrey Alan Kash, Daniel Ray Knebel, Phillip J Nigh, Pia Naoko Sanda, James Chen-Hsiang Tsang, David Paul Vallett
  • Using time resolved light emission from VLSI circuit devices for navigation on complex systems
    Patent number: 6304668
    Abstract: A system and method for determining the location of a particular device on an integrated circuit chip is described. The system and method utilize apparatus for detecting the emission of light during switching events of devices in the circuit during the circuit's processing of an input calculated to actuate the device whose location is desired. Light emissions from the circuit can be temporally and spatially indexed so as to allow deduction, in combination with the a priori knowledge of the logical operation of the circuit, of the location of the desired element. In another embodiment of the invention, a series of images of the circuit can be accumulated, representing the circuit's response to a series of different input signals, each input signal being designed to result in the switching of the desired element. The series of images can be compared to determine the location of the desired element.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: October 16, 2001
    Assignee: International Business Machines Corporation
    Inventors: Richard James Evans, Jeffrey Alan Kash, Daniel Ray Knebel, Phillip J Nigh, Pia Naoko Sanda, James Chen-Hsiang Tsang, David Paul Vallett
  • Micro probe ring assembly and method of fabrication
    Patent number: 6232143
    Abstract: A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe points. Semiconductor machining processes are used to complete the probe ring assembly.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: May 15, 2001
    Assignee: International Business Machines Corporation
    Inventors: John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett
  • Micro probe ring assembly and method of fabrication
    Patent number: 6014032
    Abstract: A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe points. Semiconductor machining processes are used to complete the probe ring assembly.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: January 11, 2000
    Assignee: International Business Machines Corporation
    Inventors: John Thomas Maddix, Anthony Michael Palagonia, Paul Joseph Pikna, David Paul Vallett