Patents by Inventor David Price Tefft

David Price Tefft has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Control of imaging assembly with interchangeable radiation shielding
    Patent number: 10586624
    Abstract: Disclosed herein are an imaging assembly and a method of controlling the imaging assembly. The assembly includes a housing having a sensor configured to detect radiation impinging on the sensor from a plurality of directions. The assembly may employ one or more shields, including a first internal shield having a first annular body between a first inner surface and a first outer surface. The first internal shield is configured to be placed in the housing such that the first inner surface at least partially surrounds the sensor. When the first internal shield is placed in the housing, the sensor is configured to receive a first central zone radiation through a first field of view, and a first peripheral zone radiation through a first peripheral view. The assembly is configured to provide at least one of a controllable field of view and reduced background contamination in an image domain.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: March 10, 2020
    Assignee: H3D, Inc.
    Inventors: David Price Tefft, William Robert Kaye, Weiyi Wang, Yvan Anders Boucher, Jason Michael Jaworski, Christopher Glenn Wahl
  • CONTROL OF IMAGING ASSEMBLY WITH SHIELDING
    Publication number: 20190037142
    Abstract: Disclosed herein are an imaging assembly and a method of controlling the imaging assembly. The assembly includes a housing having a sensor configured to detect radiation impinging on the sensor from a plurality of directions. The assembly may employ one or more shields, including a first internal shield having a first annular body between a first inner surface and a first outer surface. The first internal shield is configured to be placed in the housing such that the first inner surface at least partially surrounds the sensor. When the first internal shield is placed in the housing, the sensor is configured to receive a first central zone radiation through a first field of view, and a first peripheral zone radiation through a first peripheral view. The assembly is configured to provide at least one of a controllable field of view and reduced background contamination in an image domain.
    Type: Application
    Filed: July 31, 2017
    Publication date: January 31, 2019
    Applicant: H3D, Inc.
    Inventors: David Price Tefft, William Robert Kaye, Weiyi Wang, Yvan Anders Boucher, Jason Michael Jaworski, Christopher Glenn Wahl