Patents by Inventor David R. Cowles

David R. Cowles has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10461450
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: October 29, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Patent number: 10418754
    Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: September 17, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
  • Publication number: 20190027845
    Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.
    Type: Application
    Filed: July 24, 2017
    Publication date: January 24, 2019
    Inventors: James D. Hensley, David R. Cowles, David G. Rohrer
  • Publication number: 20180358753
    Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.
    Type: Application
    Filed: November 30, 2015
    Publication date: December 13, 2018
    Inventors: James D. Hensley, Chadi Farid Theodossy, David R. Cowles
  • Patent number: 9519813
    Abstract: A radio frequency identification (RFID) transceiver may be associated with an identification proximity to identify an RFID tag associated with a component. A control may determine proper inflation of component based on the RFID tag being identified.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 13, 2016
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Rajeev Grover, David R Cowles
  • Publication number: 20160239058
    Abstract: A fan of a computing system is associated with a performance characteristic. It may be determined whether a component associated with the computing system is installed based on the performance characteristic.
    Type: Application
    Filed: April 25, 2016
    Publication date: August 18, 2016
    Inventors: David R. Cowles, Rajeev Grover
  • Patent number: 9322681
    Abstract: A fan of a computing system is associated with a performance characteristic. It may be determined whether a component associated with the computing system is installed based on the performance characteristic.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: April 26, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David R Cowles, Rajeev Grover
  • Publication number: 20140368311
    Abstract: A radio frequency identification (RFID) transceiver may be associated with an identification proximity to identify an RFID tag associated with a component. A control may determine proper inflation of component based on the RFID tag being identified.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 18, 2014
    Inventors: Rajeev Grover, David R. Cowles
  • Publication number: 20140036451
    Abstract: A heat sink assembly includes a printed circuit board, a heat sink, and clamp, and at least two clamp retainers. The printed circuit board has at least two holes extending from a front surface to a back surface of the printed circuit board. The heat sink is mounted to the printed circuit board. The heat sink has a bottom side and a plurality of fins extending from a top side. The clamp is coupled to the printed circuit board. The clamp includes a beam extending across the heat sink and between adjacent fins, at least two legs extending through the at least two holes of the printed circuit board, and a foot extending from each of the at least two legs contacting the back surface of the printed circuit board. The at least two clamp retainers extend through the at least two holes adjacent to the at least two legs.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Inventors: Glenn C. Simon, David R. Cowles, James D. Hensley, Chadi Farid Theodossy, David G. Rohrer, Teri F. Greenhoe
  • Patent number: 8608493
    Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: December 17, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David R Cowles, Robert Dobbs, James D Hensley, John Machado
  • Publication number: 20130288494
    Abstract: A keying mechanism within a device bay allows a device connector of a device to make electrical connection with the device bay connector when a key slot of the device is located in one of a plurality of predetermined locations on the device. The keying mechanism prevents the device connector from making electrical connection with the device bay connector when the device does not have a key slot in any of the predetermined locations.
    Type: Application
    Filed: April 25, 2012
    Publication date: October 31, 2013
    Inventors: David R. Cowles, Robert Dobbs, James D. Hensley, John Machado
  • Publication number: 20130194585
    Abstract: An optical emitter may be associated with an arbitrary pattern to be reflected by a component. A controller may determine proper installation of the component based on identifying the arbitrary pattern in a received optical signal.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 1, 2013
    Inventors: David R. Cowles, Rajeev Grover
  • Publication number: 20130138364
    Abstract: A fan of a computing system is associated with a performance characteristic. It may be determined whether a component associated with the computing system is installed based on the performance characteristic.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 30, 2013
    Inventors: David R. Cowles, Rajeev Grover
  • Patent number: 8353718
    Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: January 15, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James D. Hensley, David R. Cowles, David L. Mallery
  • Publication number: 20120156922
    Abstract: A handle assembly is for use with an electronic device having a chassis, where at least a portion of the handle assembly is part of a path that crosses through the chassis. The handle assembly has a handle member moveable with respect to the chassis, wherein the handle member has a profile to allow for gripping by a user to move the electronic device. The handle assembly has an electrical contact to make electrical connection with the grounding mechanism of the chassis upon the handle member being moved to a first position.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: JAMES D. HENSLEY, David R. Cowles, David L. Mallery
  • Patent number: 6599136
    Abstract: A socket apparatus for receiving and supporting a plug-in module in a host device such as a peripheral device. The socket apparatus is mounted and fully supported by a printed circuit board and requires no additional support from the host device chassis or by a cosmetic case or housing. The apparatus is elevated relative to the printed circuit board so that valuable real estate on the board is not appreciably diminished by the apparatus. The apparatus provides an effective low impedance REI ground path, provides support to the host electrical connector and minimizes a number of parts and tolerance stack-up.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: July 29, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Steven D. Sheldon, David R. Cowles, Melissa S. Gedraitas
  • Publication number: 20020094709
    Abstract: A socket apparatus is disclosed for receiving and supporting a plug-in module in a host device such as a peripheral device. The socket apparatus is mounted and fully supported by a printed circuit board and requires no additional support from the host device chassis or by a cosmetic case or housing. The apparatus is elevated relative to the printed circuit board so that valuable real estate on the board is not appreciably diminished by the apparatus. The apparatus provides an effective low impedance RFI ground path, provides support to the host electrical connector and minimizes a number of parts and tolerance stack-up.
    Type: Application
    Filed: January 16, 2001
    Publication date: July 18, 2002
    Inventors: Steven D. Sheldon, David R. Cowles, Melissa S. Gedraitas
  • Patent number: D511791
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: November 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Steven D. Sheldon, David R. Cowles, Maaike Evers, Gil Wong