Patents by Inventor David R. Haas

David R. Haas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lasable bond-ply materials for high density printed wiring boards
    Publication number: 20040170795
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Application
    Filed: November 17, 2003
    Publication date: September 2, 2004
    Applicant: AlliedSignal Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J. Pommer
  • Microfiber dielectrics which facilitate laser via drilling
    Patent number: 6530147
    Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: March 11, 2003
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe
  • Lasable bond-ply materials for high density printed wiring boards
    Patent number: 6245696
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: June 12, 2001
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J. Pommer
  • Microfiber dielectrics which facilitate laser via drilling
    Patent number: 6224965
    Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: May 1, 2001
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe
  • Polarization-insensitive linear waveguide electrooptic phase modulator
    Patent number: 4932737
    Abstract: In one embodiment this invention provides a polarization-insensitive linear waveguide electrooptic phase modulator device. In the linear waveguide structure, the optical path has two sets of electrodes, which apply a horizontal electric field and a vertical electric field, respectively, to a nonlinear optically responsive polymeric medium in the optical path. The polymer medium section between each set of electrodes has a noncentrosymmetric molecular orientation parallel to the respective electric fields.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: June 12, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Hyun-Nam Yoon, David R. Haas
  • Polarization-insensitive interferometric waveguide electrooptic modulator
    Patent number: 4932738
    Abstract: In one embodiment this invention provides a polarization-insensitive interferometric waveguide electrooptic modulator device. In a Mach-Zehnder type of waveguide geometry, one of the divergent optical paths has two sets of electrodes, which apply a horizontal electric field and a vertical electric field, respectively, to a nonlinear optically responsive polymeric medium in the optical path. The polymer medium section between each set of electrodes has a noncentrosymmetric molecular orientation parallel to the respective electric fields.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: June 12, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: David R. Haas, Hyun-Nam Yoon, Chia C. Teng, Hong-Tai Man, James B. Stamatoff
  • Frequency doubling polymeric waveguide
    Patent number: 4865406
    Abstract: In one embodiment this invention provides a frequency doubling optical waveguide consisting of a substrate-supported polymeric thin film which exhibits second order nonlinear optical response, and which has a periodic structure for quasi-phase matching of propagating laser wave energy.In a preferred embodiment the waveguide has a two-dimensional channel structure for intensified single mode wave transmission.
    Type: Grant
    Filed: November 9, 1988
    Date of Patent: September 12, 1989
    Assignee: Hoechst Celanese Corp.
    Inventors: Garo Khanarian, David R. Haas