Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A ground-based antenna assembly (10) is provided that includes an assembly base (14) defining a substantially horizontal plane (18) and configured for attachment to a residential, commercial or governmental structure. The ground-based antenna (10) also includes a plurality of planar receiving panels (22) having a circular and/or elliptical shape. The plurality of planar receiving panels (22) are radially-spaced about the assembly base (14) and tilted with respect to the substantially horizontal plane (18) for a receiving field-of-view. The ground-based antenna assembly (10) further includes a plurality of planar transmitting panels (26) having a circular and/or elliptical shape. The plurality of planar transmitting panels (26) are radially-spaced about the assembly base (14) and tilted with respect to the substantially horizontal plane (18) for a transmitting field-of-view.

Abstract: A ground-based antenna assembly (10) is provided that includes an assembly base (14) defining a substantially horizontal plane (18) and configured for attachment to a residential, commercial or governmental structure. The ground-based antenna (10) also includes a plurality of planar receiving panels (22) having a circular and/or elliptical shape. The plurality of planar receiving panels (22) are radially-spaced about the assembly base (14) and tilted with respect to the substantially horizontal plane (18) for a receiving field-of-view. The ground-based antenna assembly (10) further includes a plurality of planar transmitting panels (26) having a circular and/or elliptical shape. The plurality of planar transmitting panels (26) are radially-spaced about the assembly base (14) and tilted with respect to the substantially horizontal plane (18) for a transmitting field-of-view.

Abstract: A satellite assembly (60, 68, 70) is formed from any number of bus modules (22) which have a substantially common shape and interior space volume. Each bus module (22) includes a structural frame (20) which is part of a structural subsystem and at least one and possibly all of a propulsion subsystem (28), a power subsystem (30), a thermal subsystem (32), an attitude, orientation and control subsystem (34), a telemetry, tracking and control subsystem (42) and a payload subsystem (44). Within each bus module (22), the subsystems are substantially non-redundant. Bus modules (22) attach together permanently or temporarily through attachment mechanisms (36). Permanent attachment is used to form large and/or redundancy within the satellites. Temporary attachment is used to increase the structural rigidity of individual bus modules (22) for launch purposes, then the assembly (60) is decomposed into individual satellites.