Abstract: A multilayer filter printed circuit board includes filtering material in one or more filter layers. The filtering material can include superconducting material, normal material, magnetic material and semi-conductor material. The multilayer filter printed circuit board may be used as part of a tubular filter structure. The filtering material may be dispersed in, or on the filter layers in a pattern or at random. The filter layers may have a first and second portion that are co-planar, and comprising different filtering materials from one another. The first and second portion may be electrically isolated from one another. Two or more filter layers may comprise different filtering materials from one another. Additional filter layers comprising filtering material may be formed outward of the outer electrically insulative layers.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Abstract: This invention relates to a novel horizontal fluid bed reactor, which in a single unit, provides for the polymerization of monomer to polymer and mixed monomers to co-polymers. Within one reactor shell the reactor contains a plurality of polymerization stages which permit the achievement of narrow residence time distribution of the produced polymer. This arrangement also creates a sufficiently tight subdivision of the reactor volume which permits a plurality of gas circulation stages of different gas compositions, as well as, polymerization temperatures.

Abstract: This invention relates to a novel horizontal fluid bed reactor, which in a single unit, provides for the polymerization of monomer to polymer and mixed monomers to copolymers. Within one reactor shell the reactor contains a plurality of polymerization stages which permit the achievement of narrow residence time distribution of the produced polymer. This arrangement also creates a sufficiently tight subdivision of the reactor volume which permits a plurality of gas circulation stages of different gas compositions, as well as, polymerization temperatures.

Abstract: A method and apparatus for forming a self-supporting tray-like container wherein a product-receiving well protrudes into a second well in an all-round mutually spaced relationship. The method calls for two parts, each formed with a well therein and each part formed of a thermoplastic having a different resistance to thermal deformation, to be joined at their peripheries. The present invention additionally provides that the two parts are to be formed simultaneously, their peripheries are to be joined so that their respective wells extend in opposite directions after which one well is inverted into the other.

Abstract: A self-supporting tray-like product container (especially for food) having an inner dished part for accommodating the product in a first well, and an outer dished part having a second well into which the first well protrudes, the inner and outer parts contacting and being joined to each other at their respective peripheral edges otherwise with their wells in all-round mutually-spaced relation. The spacing provides thermal and/or shock insulation and allows the inner and outer parts to be made of different materials especially one having different thermal deformation resistances which allows use of the package in either a conventional or a microwave oven or both according to the materials chosen.