Abstract: A method, in accordance with one aspect of the present invention, includes forming various layers of a data read transducer structure and of a lower shield layer of a servo read transducer structure in an array with the data read transducer structure in common fabrication steps. The formed dielectric layers of both read transducer structures, coupled with the unique shield structure of the data read transducer structure, work in concert to provide robust resistance to asperity-induced shorting while also lower smaller read gap thickness.

Abstract: In one general approach, an apparatus includes a read transducer structure having a media facing surface. The read transducer structure has a lower shield, and an upper shield formed above the lower shield. The upper and lower shields providing magnetic shielding. A current-perpendicular-to-plane sensor is positioned between the upper and lower shields. A dielectric layer extends into one of the shields from the media facing surface. The dielectric layer extends into the one of the shields for a distance that is less than a height of the one of the shields. Preferably, a first dielectric layer extends into the lower shield from the media facing surface, and a second dielectric layer extends into the upper shield from the media facing surface.

Abstract: An approach to forming a tape head with a first soft bias pinning layer in a tape head structure. The tape head structure includes an antiferromagnetic material forming the first soft bias pinning layer over a sensor and stitching into a soft bias layer surrounding the sensor where the antiferromagnetic material of the first soft bias pinning layer has a lower magnetic reluctance than a material forming a freelayer in the sensor. Furthermore, the tape head structure includes a first spacer separated from the first soft bias pinning layer by the sensor in the tape head structure and a second spacer layer over the first soft bias pinning layer where a thickness of the first spacer and the second spacer is determined by an optimum shield to shield distance in the tape head structure.

Abstract: An apparatus, in accordance with one aspect of the present invention, includes a module having a media facing surface. The module comprises the following components. A sensor is recessed from the media facing surface. A flux guide extends from the media facing surface toward the sensor. A soft bias layer is positioned on opposite sides of the sensor in a cross-track direction. A stabilization layer is located above the sensor, flux guide and soft bias layer for stabilizing the soft bias layer. A nonmagnetic exchange break layer is positioned above the sensor and the flux guide for magnetically decoupling the sensor and the flux guide from the stabilization layer.

Abstract: An apparatus, in accordance with one embodiment, includes a write transducer having a pair of writer poles having pole tips, the pole tips defining a write gap therebetween. A thin film device is positioned at least in part in the write gap for raising a local temperature of the write gap. Electrical connections for causing a current to pass through the thin film device are also present. A method, in accordance with one embodiment, includes passing a current through a thin film device positioned at least in part in a write gap defined between pole tips of writer poles of a write transducer for causing heating of the thin film device. A level of the current is changed in response to detection of a predefined condition.

Abstract: An apparatus, according to one embodiment, includes a module having an array of transducers, and at least two expansion elements positioned proximate the array of transducers. The expansion elements are arranged side by side along a line extending parallel to a longitudinal axis of the array of transducers, wherein the array of transducers includes at least three servo readers. A controller is electrically coupled to the expansion elements, and is configured to individually control an extent of expansion of each expansion element based on feedback from the servo readers.

Abstract: An apparatus, in accordance with one approach, includes a module having a first array of read transducers. A first electrical shielding layer is positioned above the first array of read transducers. An array of write transducers is positioned above the first electrical shielding layer. A second electrical shielding layer is positioned above the array of write transducers. A second array of read transducers is positioned above the second electrical shielding layer.

Abstract: One embodiment of the present invention provides a slider including a slider body, a magnetic reader disposed on the slider body, a magnetic writer disposed on the slider body, and an electronic lapping guide disposed on the slider body. The slider also includes a first row of contact pads disposed on the slider body and coupled to the magnetic reader and the magnetic writer and a second row of contact pads disposed on the slider body and coupled to the electronic lapping guide. The electronic lapping guide may be electrically isolated from the magnetic reader and magnetic writer.

Abstract: Tunneling magnetoresistive (TMR) electrical lapping guides (ELG) are disclosed for use in wafer fabrication of magnetic sensing devices, such as magnetic recording heads using TMR read elements. A TMR ELG includes a TMR stack comprising a first conductive layer, a barrier layer, and a second conductive layer of TMR material. The TMR ELG also includes a first lead and a second lead that connect to conductive pads used for applying a sense current to the TMR ELG in a current in plane (CIP) fashion. The first lead contacts one side of the TMR stack so that the first lead contacts both the first conductive layer and the second conductive layer of the TMR stack. The second lead contacts the other side of the TMR stack so that the second lead contacts both the first conductive layer and the second conductive layer of the TMR stack.

Abstract: A slider for a magnetic disk drive is disclosed which includes a heater circuit structure, and at least one ELG circuit structure where a portion of the ELG circuit structure is removable by lapping. The ELG circuit structure is connected electrically in parallel with the heater circuit structure to a common set of electrical contact pads to produce a measured initial parallel resistance as measured at the common set of electrical contact pads. A modified parallel resistance is calculated to correspond to that of the modified individual resistance of the ELG when lapping operation is completed. The resistance is monitored during lapping operations to signal when the appropriate lapping depth is achieved. Also disclosed is a disk drive having the slider, and a method of fabrication for a slider.

Abstract: A method for merging sensor field-mill and electronic lapping guide material placement for a partial mill process and sensor formed according to the method is disclosed. An electronic lapping guide is formed coplanar with a sensor. The coplanar electronic lapping guide and sensor are processed to provide the electronic lapping guide and sensor with predetermined dimensions. The merging of the sensor field-mill and placement of the electronic lapping guide material for partial mill CPP eliminates steps and therefore the cycle time. Moreover, the electronic lapping guide region is raised to the height of the sensor plane to allow the sensor and electronic lapping guide to be defined in the same focal plane of the optics.

Abstract: In a tunnel magnetoresistive (TMR) device, free sublayers are separated by an intermediate spacer layer that serves to ensure a uniform circumferential magnetization in the free stack, counterbalancing orange-peel coupling by antiferromagnetic exchange coupling. Thus, a CPP MR device may have a seed stack, a pinned stack on the seed stack, and a tunnel barrier on the pinned stack. A free stack can be on the tunnel barrier, and the free stack can include structure for promoting uniform circumferential magnetization in the free stack.

Abstract: One embodiment of the present invention provides a slider including a slider body, a magnetic reader disposed on the slider body, a magnetic writer disposed on the slider body, and an electronic lapping guide disposed on the slider body. The slider also includes a first row of contact pads disposed on the slider body and coupled to the magnetic reader and the magnetic writer and a second row of contact pads disposed on the slider body and coupled to the electronic lapping guide. The electronic lapping guide may be electrically isolated from the magnetic reader and magnetic writer.

Abstract: A method of temporarily protecting an electrically sensitive component from damage due to electrostatic discharge includes defining a shunt having first and second leads electrically connected in parallel with the component and separated by a gap. A portion of a shield layer is deposited to form the shunt between the first and second leads to span the gap therebetween and form a shunted assembly. The shunted assembly and component are lapped to form the ABS at the location of the component, a sacrificial carbon overcoat is deposited on the ABS, and additional processing is performed on the shunted assembly. A portion of the shunted assembly, the shunt, and portions of the sacrificial carbon overcoat are then removed to form an electrical open for an unshunted assembly having ABS features comprising an air bearing cavity/deep gap at a former location of the shunted assembly.

Abstract: A method for fabricating magnetic side shields for an MR sensor of a magnetic head. Following the deposition of MR sensor layers, a first DLC layer is deposited. Milling mask layers are then deposited, and outer portions of the milling mask layers are removed such that a remaining central portion of the milling mask layers is formed having straight sidewalls and no undercuts. Outer portions of the sensor layers are then removed such that a relatively thick remaining central portion of the milling mask resides above the remaining sensor layers. A thin electrical insulation layer is deposited, followed by the deposition of magnetic side shields. A second DLC layer is deposited and the remaining mask layers are then removed utilizing a chemical mechanical polishing (CMP) liftoff step. Thereafter, the first DLC layer and the second DLC layer are removed and a second magnetic shield layer is then fabricated thereabove.

Abstract: Systems and methods for the manufacture of a magnetic head. A first embodiment provides an apparatus for the manufacture of a magnetic head comprising a feedback control loop to terminate lapping of the magnetic head responsive to achieving a target signal to noise ratio for the magnetic head.

Abstract: A recording head is disclosed that includes electrical pads on multiple surfaces. The recording head includes a substrate portion abutting a deposited portion. The deposited portion includes an air bearing surface (ABS) (or bottom surface), an end surface, and at least one other surface. The end surface is the surface traditionally used by head designers for electrical pads. In accord with the invention, one or more electrical pads are included on the other surfaces of the deposited portion (i.e., a surface other than the end surface). Electrical pads may also be included on the end surface.

Abstract: A wafer-level shunt is incorporated into a sensor design. The sensor is formed with two shields. When the ABS is etched into the slider, this region of the ABS is recessed to form a deep etch region. A top of the shunt is centered in this region and a bottom of the shunt is located therebelow. The two shields form the sensor leads and are electrically connected to the shunt. The shunt is fabricated by depositing and plating a shield one seed layer, and plating a shield one bar for the shunt. A protection layer protects the seed between shield one and the shield one shunt material. Some of the material is deposited, milled, and refilled with insulation. The unmilled material remains as the sensor and the deep etch shunt. Shield two is deposited and connects to the top of the deep etch shunt. A metallic lead connection is located between the two shields to short the shield two shunt material to shield two of the sensor.

Abstract: Systems and methods for the manufacture of a magnetic head. A first embodiment provides an apparatus for the manufacture of a magnetic head comprising a feedback control loop to terminate lapping of the magnetic head responsive to achieving a target signal to noise ratio for the magnetic head.

Abstract: The structure for a narrow pitch tape head array is disclosed. Narrow pitch is obtained by offsetting the location of the write gaps of successively stacked coplanar head arrays. A compact structure with lower fabrication cost is obtained by sharing magnetic pole layers between the stacked co-planar arrays.