Abstract: The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.

Abstract: The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.

Abstract: The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material at least partially covering the IC die, where (a) the encapsulation material defines a plurality of microchannels within the encapsulation material and (b) the plurality of microchannels are configured to carry fluid through the encapsulation material between one or more microchannel inlets and one or more microchannel outlets located at an exterior of the encapsulation material, (3) a plurality of flow valves positioned in the plurality of microchannels, and (4) a plurality of sensors, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.

Abstract: Enabling secure and efficient marshaling, utilization, and releasing of handles in either of an operating system or runtime environment includes wrapping a handle with a counter to tabulate a number of threads using currently using the handle. Thus, handle administration is implemented to circumvent potential security risks, avoid correctness problems, and foster more efficient handle releasing.