Abstract: A graded gap fill process in which, in a high density plasma processing chamber, an insulating layer is deposited on a substrate without causing plasma charge-related damage to the substrate. The insulating layer is disposed above a first layer having trenches formed therein and below a subsequently deposited second layer. A protection layer is first deposited above the first layer using a first set of deposition parameters. This protection layer coats a surface of the first layer in a substantially conformal manner without forming voids in the trenches. A fill layer is then deposited above the protection layer using a second set of deposition parameters. The first set of deposition parameters is selected to reduce plasma charge-related damage relative to the second set of deposition parameters. The combination of the protection layer and the fill layer sufficiently electrically isolates the first layer from the second layer.

Abstract: A process of preparing a moisture-resistant fluorine containing SiO.sub.x film includes steps of supplying reactant gases containing silicon, oxygen and fluorine into a process chamber and generating plasma in the process chamber, supporting a substrate on a substrate support in the process chamber, depositing a fluorine-containing SiO.sub.x film on the substrate by contacting the substrate with the plasma while maintaining temperature of the film above 300.degree. C., and nitriding an exposed surface of the film with a high density plasma. The silicon and fluorine reactants can be supplied by separate gases such as SiH.sub.4 and SiF.sub.4 or as a single SiF.sub.4 gas and the oxygen reactant can be supplied by a pure oxygen gas. The SiH.sub.4 and SiF.sub.4 can be supplied in a ratio of SiH.sub.4 /(SiH.sub.4 +SiF.sub.4) of no greater than 0.5. The process can provide a film with a fluorine content of 2 to 12 atomic percent and argon can be included in the plasma to assist in gap filling.

Abstract: A narrow-band pyrometric system measures the temperature of an object (1), such as a semiconductor wafer (1), that is coated with a film (2) having an absorption band. The thermal radiation emitted by the coated object (1) passes through a lens (3) and aperture (4), and then a filter (5). The passband of this filter (5) falls within the absorption band of the film (2). The transmitted radiation is then collected by the radiation detector (6), which measures the intensity. The detected radiation is at a wavelength where the heated object (1) is substantially opaque, and the effect of uncertainties in the emissivity on the temperature measurement is minimized. Thus, a method is provided to coat the object (1) with a film (2) of material having an absorption band encompassing the filter (5) passband, and a thickness sufficiently great that the object (1) appears opaque when viewed through the filter (5).