Patents by Inventor David T. M. Shen

David T. M. Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of clocking integrated circuit chips
    Patent number: 5430567
    Abstract: A method of clocking integrated circuit chips. A pulsed laser striking an integrated circuit module substrate is diffused through the substrate and exits the opposite surface as diffused light pulses. An integrated circuit chip mounted on the top surface of the substrate has optical receivers. The optical receivers receive pulsed energy from the diffused light pulses, converting pulsed light to electrical pulses that clock the chip.
    Type: Grant
    Filed: July 25, 1994
    Date of Patent: July 4, 1995
    Assignee: International Business Machines Corporation
    Inventors: Robert R. Shaw, David T.-M. Shen
  • Method for replacing IC chip package interposer
    Patent number: 5384955
    Abstract: A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.
    Type: Grant
    Filed: January 5, 1994
    Date of Patent: January 31, 1995
    Assignee: International Business Machines Corporation
    Inventors: Richard B. Booth, Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. M. Shen