Patents by Inventor David Talmage PATTEN
David Talmage PATTEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10455309Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).Type: GrantFiled: December 4, 2015Date of Patent: October 22, 2019Assignee: Cirrus Logic, Inc.Inventors: Tsjerk Hoekstra, David Talmage Patten
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Patent number: 10334339Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.Type: GrantFiled: December 4, 2015Date of Patent: June 25, 2019Assignee: Cirrus Logic, Inc.Inventors: John Laurence Pennock, Tsjerk Hoekstra, David Talmage Patten
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Patent number: 10117028Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).Type: GrantFiled: January 27, 2017Date of Patent: October 30, 2018Assignee: Cirrus Logic, Inc.Inventors: David Talmage Patten, Tsjerk Hans Hoekstra
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Publication number: 20170374473Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, David Talmage PATTEN
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Publication number: 20170374441Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, David Talmage PATTEN
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Publication number: 20170374442Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: John Laurence PENNOCK, Tsjerk HOEKSTRA, David Talmage PATTEN
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Publication number: 20170223466Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).Type: ApplicationFiled: January 27, 2017Publication date: August 3, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: David Talmage PATTEN, Tsjerk Hans HOEKSTRA