Abstract: Disclosed herein are integrated circuit (IC) package substrates formed with a dielectric bi-layer, and related devices and methods. In some embodiments, an IC package substrate is fabricated by: forming a raised feature on a conductive layer; forming a dielectric bi-layer on the conductive layer, where the dielectric bi-layer includes a first sub-layer having a first material property and a second sub-layer having a second material property, and where the top surface of the second sub-layer is substantially planar with the top surface of the raised feature; and removing the first sub-layer until the second material property is detected to reveal the conductive feature. In some embodiments, an IC package substrate is fabricated by: forming a dielectric bi-layer on a patterned conductive layer, where the first sub-layer is less susceptible to removal than the second sub-layer; forming an opening in the dielectric bi-layer; etching; and forming a via having vertical sidewalls.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: Disclosed herein are integrated circuit (IC) package substrates formed with a dielectric bi-layer, and related devices and methods. In some embodiments, an IC package substrate is fabricated by: forming a raised feature on a conductive layer; forming a dielectric bi-layer on the conductive layer, where the dielectric bi-layer includes a first sub-layer having a first material property and a second sub-layer having a second material property, and where the top surface of the second sub-layer is substantially planar with the top surface of the raised feature; and removing the first sub-layer until the second material property is detected to reveal the conductive feature. In some embodiments, an IC package substrate is fabricated by: forming a dielectric bi-layer on a patterned conductive layer, where the first sub-layer is less susceptible to removal than the second sub-layer; forming an opening in the dielectric bi-layer; etching; and forming a via having vertical sidewalls.

Abstract: Disclosed herein are pocket structures, materials, and methods for integrated circuit (IC) package supports. For example, in some embodiments, an IC package support may include: an interconnect pocket having sidewalls provided by a dielectric material; and a conductive contact at a bottom of the interconnect pocket, wherein the conductive contact includes a first metal material and a second metal material, the first metal material provides a bottom surface of the interconnect pocket and is in contact with the dielectric material, the second metal material has a different composition than the first metal material, and the second metal material is in contact with the dielectric material.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and. associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: Methods/structures of forming package structures are described. Those methods/structures may include forming a first conductive trace adjacent a second conductive trace on a dielectric material of a high density package substrate. A barrier layer is formed on at least one of the first conductive trace or the second conductive trace, wherein the barrier layer comprises a corrosion resistant material, and forming a conductive via on a portion of the barrier layer.

Abstract: Systems and methods for active noise cancellation are provided. An example method includes receiving at least two reference signals associated with at least two reference positions. Each of the at least two reference signals includes at least one captured acoustic sound representing an unwanted noise. The reference signals are filtered by individual filters to obtain filtered signals. The filtered signals are combined to obtain a feedforward signal. The feedforward signal is played back to reduce the unwanted noise at a pre-determined space location. The individual filters are determined based on linear combinations of at least two transfer functions. Each of the at least two transfer functions is associated with one of the reference positions. In certain embodiments, the at least two reference signals are captured by at least two feedforward microphones.

Abstract: Systems and methods for active noise cancellation are provided. An example method includes receiving at least two reference signals associated with at least two reference positions. Each of the at least two reference signals includes at least one captured acoustic sound representing an unwanted noise. The reference signals are filtered by individual filters to obtain filtered signals. The filtered signals are combined to obtain a feedforward signal. The feedforward signal is played back to reduce the unwanted noise at a pre-determined space location. The individual filters are determined based on linear combinations of at least two transfer functions. Each of the at least two transfer functions is associated with one of the reference positions. In certain embodiments, the at least two reference signals are captured by at least two feedforward microphones.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: Systems and methods for acoustic echo cancellation are provided. An example method includes receiving a reference signal. The reference signal represents at least one sound captured inside an enclosure of a loudspeaker. The loudspeaker is operable to play back a far end signal. The method also includes receiving an acoustic signal. The acoustic signal represents at least one sound captured outside the enclosure of the loudspeaker. The acoustic signal includes at least a near end signal and the far end signal. The method enables attenuation, using the reference signal, the far end signal in the acoustic signal. The reference signal can be captured by a low sensitivity microphone placed inside the enclosure of the loudspeaker. The attenuation of the far end signal may include subtractive cancellation.

Abstract: An acoustic transducer comprises one or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers. The diaphragms may be driven directly, inertially or fluidically. If diaphragms are driven by rods that pass through holes in the diaphragms, noise may be generated by air that leaks through the pass-through holes. This noise may be reduced or eliminated by measures that reduce or eliminate the air leakage.

Abstract: An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.

Abstract: Systems and methods for acoustic echo cancellation are provided. An example method includes receiving a reference signal. The reference signal represents at least one sound captured inside an enclosure of a loudspeaker. The loudspeaker is operable to play back a far end signal. The method also includes receiving an acoustic signal. The acoustic signal represents at least one sound captured outside the enclosure of the loudspeaker. The acoustic signal includes at least a near end signal and the far end signal. The method enables attenuation, using the reference signal, the far end signal in the acoustic signal. The reference signal can be captured by a low sensitivity microphone placed inside the enclosure of the loudspeaker. The attenuation of the far end signal may include subtractive cancellation.

Abstract: An acoustic transducer includes a housing, a plurality of diaphragms suspended from the housing and separated into one or more groups, and one or more motors combined with the housing that operate in response to an electrical signal. The diaphragms of each group are driven by a respective motor to which all the diaphragms in the group are coupled and at least one motor has an indirect coupling with no direct mechanical connection to the diaphragms driven thereby. One or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers.

Abstract: An acoustic transducer includes a housing, a plurality of diaphragms suspended from the housing and separated into one or more groups, and one or more motors combined with the housing that operate in response to an electrical signal. The diaphragms of each group are driven by a respective motor to which all the diaphragms in the group are coupled and at least one motor has an indirect coupling with no direct mechanical connection to the diaphragms driven thereby. One or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers.

Abstract: An acoustic transducer comprises one or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers. The diaphragms may be driven directly, inertially or fluidically. If diaphragms are driven by rods that pass through holes in the diaphragms, noise may be generated by air that leaks through the pass-through holes. This noise may be reduced or eliminated by measures that reduce or eliminate the air leakage.

Abstract: An acoustic transducer comprises one or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers. The diaphragms may be driven directly, inertially or fluidically. If diaphragms are driven by rods that pass through holes in the diaphragms, noise may be generated by air that leaks through the pass-through holes. This noise may be reduced or eliminated by measures that reduce or eliminate the air leakage.

Abstract: An acoustic transducer comprises one or more electromagnetic motors that drive one or more sets of multiple diaphragms to provide acoustically efficient loudspeaker systems having dimensions that allow use in applications that would be difficult or impossible with traditional transducers. The diaphragms may be driven directly, inertially or fluidically. If diaphragms are driven by rods that pass through holes in the diaphragms, noise may be generated by air that leaks through the pass-through holes. This noise may be reduced or eliminated by measures that reduce or eliminate the air leakage.