Abstract: A spill containment system for storage tanks, flow devices, and the like, and a containment system for spilled light non-aqueous phase liquid are provided. The spill containment system comprises a liner for receiving and containing liquid that spills, as well as a withdrawal tube that sealingly extends into the liner at a high point thereof. An alternative spill containment system comprises two liner portions, one about a storage tank and another about a flow device leading, for example, to a furnace. A withdrawal tube extends to a low point of the first liner portion. The containment system comprises a trench, filled for example with low capillarity medium, for at least partially surrounding an area where light non-aqueous phase liquid is stored or may migrate to. A liner is disposed over the top of the trench and along at least a portion of one side thereof. At least one withdrawal tube sealingly extends through the liner at a high point thereof and into the trench.

Abstract: A spill containment system for storage tanks, flow devices, and the like, and a containment system for spilled light non-aqueous phase liquid are provided. The spill containment system comprises a liner for receiving and containing liquid that spills, as well as a withdrawal tube that sealingly extends into the liner at a high point thereof. The containment system comprises a trench, filled for example with low capillarity medium, for at least partially surrounding an area where light non-aqueous phase liquid is stored or may migrate to. A liner is disposed over the top of the trench and along at least a portion of one side thereof. At least one withdrawal tube sealingly extends through the liner at a high point thereof and into the trench.

Abstract: A piezoelectric actuator/sensor package and corresponding method for its fabrication, and a method of embedding a ceramic actuator/sensor in a laminated structural member, such as a graphite-epoxy laminate. A ceramic actuator/sensor, with lead wires first bonded to it, is encapsulated in a non-conductive fiber composite material, such as fiberglass cloth and epoxy, to form a package that is precured at a suitable temperature, typically room temperature. Encapsulation provides electrical insulation, good strain coupling, protection from mechanical damage, and reduction in thermal stresses, since the coefficient of thermal expansion of the encapsulating material is selected to be between those of the ceramic and the graphite-epoxy laminate. Graphite fibers may be added to the package to enhance voltage-strain performance. The package is embedded in the structural laminate and the composite structure is cured in a manner that minimizes thermally-induced stresses.