Abstract: A tool-less rack mounting system includes a grooved bullet attached to a flange on the end of a slide rail assembly. The bullet protrudes through a clearance hole formed on a corner post of a rack. A hand-releasable clip engages the groove, retaining the bullet in the clearance hole and retaining the flange against the post. The clip may be mounted to a bracket, and the bracket may include features for securing equipment in the rack. A hinged cable management arm may be mounted to the post and to the slide rail assembly without using tools. A flange on one end of the arm includes a clearance hole opening into a channel. The channel engages a standoff mounted to one of the rails of the slide rail assembly. A flange on the other end of the arm may be retained against the post by the bullet and the hand-releasable clip.

Abstract: A mounting adapter a peripheral device. A strip is adapted to fit across the top or bottom of the device transversely. First and second device engagement tabs engage holes on left and right sides of the device, and first and second chassis engagement tabs engage holes on left and right sides of a chassis opening. The chassis engagement tabs and one of the device engagement tabs are disposed on arms that can be moved elastically in the transverse direction to engage and disengage the tabs with their corresponding holes. The adapter can be fashioned from a unitary piece of metal, and adds only the thickness of the strip to the vertical dimension of the peripheral device.

Abstract: An implantable medical device lead having an integral biostable in-sutu grown oxide insulation and process for forming that includes a lead body extending from a proximal end to a distal end, and a plurality of conductor wires electrically coupling the proximal end and the distal end of the lead body, with one or more of the plurality of conductor wires being formed of a material having a chemically modifiable surface for producing an insulating oxide layer thereon. An insulation layer corresponding to the native oxide layer is formed about the one or more of the plurality of conductor wires.

Abstract: A low-profile circuit board mounting and connecting scheme employs a conductive standoff having a shoulder, a stem and a head. A circuit board to be mounted on the standoff defines a clearance hole opening into a channel. The clearance hole is sufficiently large to clear the head of the standoff, and the channel is sufficiently wide to clear the stem but not the shoulder. A conductive clip has two resilient prongs. The clip is mounted to the circuit board so that the prongs are disposed along either side of a portion of the channel. The prongs are able to move toward and away from each other in a plane that is parallel to the plane of the circuit board. The prongs engage the head to make an electrical connection when the stem is moved to the end of the channel.

Abstract: A sliding rail assembly adjusts and adapts to fit various racks. An adjustable mounting flange on an end of the rail assembly translates along the axis of the rail so that the length of the rail assembly adjusts to fit racks having various depths. Hooks on the rail assembly may be used to hang the rail assembly on the rack while the rail assembly is being installed therein. The hooks are removable so that the rail assembly will fit racks having narrow widths. Mounting adapters enable the mounting flanges to mate with corner posts having round holes as well as those having square holes. Securing tabs engage front corner posts of the rack to prevent the rail and the computer enclosure from sliding out. To accommodate racks having various depths, the securing tabs may be mounted at more than one location on the side of the computer enclosure.

Abstract: A column grid array integrated circuit package has a substrate. The substrate has a solder column array having a plurality of solder columns and a plurality of rigid columns interspersed with the solder columns at no-connect locations. The rigid columns contact a circuit board to which the column grid array integrated circuit package is mounted and support the column grid array integrated circuit package against compressive force.

Abstract: A body compatible stent is formed of multiple filaments arranged in at least two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold-working steps.

Abstract: A body compatible stent is formed of multiple filaments arranged in at least two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold working steps.

Abstract: An EMI gasket exhibits enhanced compliance in the direction orthogonal to the plane of the circuit board on which a chip or chip-and-socket assembly is mounted. Therefore, the gasket may be used with chips or chip-and-socket assemblies having a variety of heights. In an embodiment, a frame made from a sheet of metal has a planar portion with an opening formed therein. The opening is adapted to fit around a perimeter of an integrated circuit chip. The sheet of metal includes top and bottom planar surfaces. Top and bottom resilient conductive members are attached to the top and bottom planar surfaces, respectively.

Abstract: A fastener assembly includes a threaded fastener having an axial shaft. A spring is disposed coaxially around the shaft and is capable of compression and expansion in the longitudinal direction defined by the shaft. First and second stops are disposed along the shaft. The spring is pre-compressed and is disposed between the stops so that its expansion is limited by the stops. One end of the spring is mechanically coupled to a work piece. When the fastener is turned, relative displacement develops between the shaft and the work piece. The displacement causes the spring to further compress as the work piece end of the spring and the second stop move away from one another. The force of the compressed spring is transferred to the work piece.

Abstract: A fastener assembly includes a threaded fastener having an axial shaft. A spring is disposed coaxially around the shaft and is capable of compression and expansion in the longitudinal direction defined by the shaft. First and second stops are disposed along the shaft. The spring is pre-compressed and is disposed between the stops so that its expansion is limited by the stops. One end of the spring is mechanically coupled to a work piece. When the fastener is turned, relative displacement develops between the shaft and the work piece. The displacement causes the spring to further compress as the work piece end of the spring and the second stop move away from one another. The force of the compressed spring is transferred to the work piece.

Abstract: An EMI gasket exhibits enhanced compliance in the direction orthogonal to the plane of the circuit board on which a chip or chip-and-socket assembly is mounted. Therefore, the gasket may be used with chips or chip-and-socket assemblies having a variety of heights. In an embodiment, a frame made from a sheet of metal has a planar portion with an opening formed therein. The opening is adapted to fit around a perimeter of an integrated circuit chip. The sheet of metal includes top and bottom planar surfaces. Top and bottom resilient conductive members are attached to the top and bottom planar surfaces, respectively.

Abstract: A computer enclosure rack mounting system employs standoff members attached to left and right rails of telescoping extension slides. A computer enclosure includes bearing surfaces that are adapted to receive the standoff members. To install the computer enclosure into the rack, the left and right rails are extended, and the computer enclosure is lowered toward the rails until the standoff members of the rails engage the bearing members so as to support the enclosure. After this has been done, the enclosure and rails are simply slid back into the rack. The rails need not be removed from the rack to install the enclosure, and the enclosure need not be mounted to the rails by means of screws or bolts. The enclosure may be easily removed from the rack by reversing the just-described procedure, and may be installed into a different slot or a different rack without removing or replacing the rails.

Abstract: A hinging cable management arm is disposed inside a rack behind a slidingly mounted computer. The arm folds and unfolds as the computer slides into and out of the rack. Cables from the computer are secured to the arm with cable ties. The arm includes two elongate members hingingly coupled to one another at one end. At the other end, one member is hingingly coupled to the rack and one member is hingingly coupled to a sliding computer mount. Each elongate member has a u-shaped profile. The hinged couplings are implemented using swaged pins. The cable ties are straps made with hook-and-loop fabric. The straps are made captive to the elongate members by anchoring them at a first slot and threading them through a second slot. They are wrapped over the computer cables and around the profile of the elongate members until the hook-and-loop material secures to itself.

Abstract: A method for treating a body vessel using a stent formed from filaments of titanium or titanium alloys such as Ti—13Zr—13Nb.

Abstract: An implantable electrical lead having a lead body with a longitudinal lumen therein and a stranded electrical conductor located in the lumen and which exits the lumen at a distal portion of the lead body, the distal end of the conductor being curved to form a loop and reentering the lumen, terminating within the lumen alongside a more proximal portion of the conductor. The portion of the conductor exterior to the lumen is wound around the lead body to form a coiled electrode. In some embodiments the distal end of the conductor is coupled to a more proximal portion of the conductor to form a loop and the loop is wound around the lead body to form a bifilar coil. In other embodiments the conductor is wound around the lead body to form a mono-filar coil. The distal end of the conductor is mechanically and electrically coupled to a more proximal portion of the conductor, within the lumen.

Abstract: A self-expanding stent formed from helically wound and braided filaments of titanium or titanium alloys such as Ti-13Zr-13Nb.

Abstract: A body compatible stent is formed of multiple filaments arranged in two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold-working steps.

Abstract: A body compatible stent is formed of multiple filaments arranged in two sets of oppositely directed helical windings interwoven with one another in a braided configuration. Each of the filaments is a composite including a central core and a case surrounding the core. In the more preferred version, the core is formed of a radiopaque and relatively ductile material, e.g. tantalum or platinum. The outer case is formed of a relatively resilient material, e.g. a cobalt/chromium based alloy. Favorable mechanical characteristics of the stent are determined by the case, while the core enables in vivo imaging of the stent. The composite filaments are formed by a drawn filled tubing process in which the core is inserted into a tubular case of a diameter substantially more than the intended final filament diameter. The composite filament is cold-worked in several steps to reduce its diameter, and annealed between successive cold-working steps.

Abstract: A biomedical lead conductor body formed of a coiled wire conductor that is sheathed loosely within a coiled insulative sheath of biocompatible and biostable material allowing a gap or space to be present between the exterior surface of the coiled wire conductor and the adjacent interior surface of the insulative sheath. The coiled insulative sheath is loosely fitted around the coiled wire conductor in order to compensate for defects in the coiled insulative sheath by spreading any corrosion of the wire that may take place because of the defect away from the site of a defect and along the surface of the coiled wire conductor. The lead body is incorporated into unipolar, bipolar or multi-polar biomedical leads having single filar coil windings, or multi-filar coil windings that may be redundantly electrically connected. The coiled wire conductors and coiled insulative sheaths may be parallel-wound and/or coaxially wound within the outer lead body insulative sheath.