Abstract: The present invention discloses a method for manufacturing a high dielectric antenna structure. In one embodiment, one or more high dielectric film layers are applied to a dielectric base layer by silk-screening to yield a dielectric structure having a dielectric constant greater than that of the dielectric base layer. After firing, a patch antenna element having a predetermined configuration is disposed on the top surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A ground plane is disposed on the bottom surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A pre-drilled dielectric base layer may be employed with registered holes defined in the various silk-screened layers to provide access for an RF feed means, or alternatively, a feed hole can be bored through the antenna structure to permit interconnection between an RF feed means and the patch antenna element.

Abstract: Method and structure are disclosed for production of a thick-film antenna. A thick-film microwave patch element (26) is patterned onto one surface of a dielectric substrate (32) and a thick-film reference surface (24) disposed onto the opposite surface. The patch element may be placed in different locations on the substrate relative to the feed hole to adjust the impedance and resonant frequency of the antenna before it has been dried and fired while tuning tabs (30) may abut the patch element for use in adjusting the impedance and resonant frequency of the antenna (20) after it has been dried and fired. In one embodiment, the substrate (24) is a ceramic material having an alumina content of about 96%. A multiple-frequency antenna can be created by stacking patch elements and dielectric layers above the reference surface.