Abstract: A non-contact ultrasound measurement device comprises: a first unit including an ultrasound transducer adapted to transmit and receives an ultrasonic wave in a non-contact manner with respect to an object to be examined, the first unit being adapted to process an output signal from the transducer and measure a first characteristic of the object; and a second unit including at least one of an observation unit for observing the object from front in a non-contact manner and a measurement unit for measuring a second characteristic of the object from front in a non-contact manner, wherein the transducer comprises: an aperture being provided in the central part of the transducer and having a sufficient size to be utilized for observation or measurement of the object by the second unit, and a transmitting and receiving part of the ultrasonic wave being provided to surround the aperture.

Abstract: There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer upon each of the top and bottom surface; creating at least one patterned backplate electrode on the board or as part of a discreet component which is then attached to the board; creating at least one conductive through-hole via integral with the board; roughening at least a portion of each of the at least one backplate to introduce gas pockets in that portion of a surface of the backplate; and attaching thin insulating or dielectric single or multi-layer film on a portion of the board in which the film has an integral conducting surface and in which the conducting surface is configured so as to form a capacitive structure with the at least one backplate.

Abstract: There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer upon each of the top and bottom surface; creating at least one patterned backplate electrode on the board or as part of a discreet component which is then attached to the board; creating at least one conductive through-hole via integral with the board; roughening at least a portion of each of the at least one backplate to introduce gas pockets in that portion of a surface of the backplate; and attaching thin insulating or dielectric single or multi-layer film on a portion of the board in which the film has an integral conducting surface and in which the conducting surface is configured so as to form a capacitive structure with the at least one backplate.

Abstract: A system for the non-contact inspection and characterization of an object in which wideband (40 kHz to approximately 2 MHz) air/gas coupled ultrasonic transducers are used. The system of the present invention enables a single set of transducers to be used in an inspection/defect detection arrangement to characterize materials having a wide range of through-thickness, and other resonances. For example, the through-thickness fundamental resonance of 11 mm thick plywood is 44 kHz, 723 kHz for 2 mm thick carbon fiber, and 1.47 kHz for 0.75 mm thick polystyrene, all of which are measurable in the same system. The system is used in a method to characterize a defect by being able to operate at or near the resonant frequency of the normal material and at or near the resonant frequency of the material in a defect region to improve the accuracy of detecting specific types of defects including inclusions, material thinning, delamination and pitting by monitoring changes of various attributes (e.g.

Abstract: An acoustic transducer which is operable in air up to at least 2MHz is described. A conducting substrate, usually a silicon wafer is etched to provide a selected pattern of micro pits up to about 30 .mu.m or more deep. A dielectric film, such as a polyimide film is placed over the etched surface so as to trap air in each individual pit. A conducting upper layer is then superimposed over the dielectric film. When a potential is applied between the substrate and the upper layer the upper layer is driven into motion and enhanced by the vibrations of the air pockets. Alternatively a smooth substrate may be employed in conjunction with an etched dielectric film to achieve the same result. These transducers are useful for non-destructive testing of large structures or for medical diagnostic and therapeutic purposes, without the need for a liquid or gel coupling agent.