Abstract: A wafer-scale module includes a plurality of stacked wafers, each having a thin semiconductor layer disposed on a surface of the wafer, a plurality of wafer-scale integrated (WSI) circuits formed on the semiconductor layer and a plurality of nodes formed on the semiconductor layer. Each node provides an optoelectronic interface to an axial optical waveguide for high-speed optical interconnectivity between the WSI circuits and other integrated wafer circuit devices of the stack. A top plate is included and is disposed on the plurality of stacked wafer devices. A base plate, included for purposes of thermal dissipation, is disposed opposite the top plate such that the plurality of stacked wafers are sandwiched between the top plate and the base plate and all are assembled.

Abstract: A spacecraft electronics equipment module that is thermally independent of a core spacecraft structure to which it can be mounted. The module takes the form of a thermal radiation panel on which electronic components are directly mounted. The panel is attachable to the core structure and includes its own double-sided radiator for cooling of the electronics components, an integral heater for raising the temperature is needed, a thermal controller, for automatically regulating the temperature of the module components, and heatpipes for distributing the heat more uniformly across the radiating surfaces.

Abstract: A spacecraft structure using functionally independent modules assembled around a lightweight core structure to provide a vehicle that is lighter, uses less volume, and is easier to design, manufacture and test than a conventional spacecraft. In the disclosed embodiments, the modules are formed on generally flat panels, which serve as thermal radiators. The modules extend radially from the core structure and are attached to the core structure either in coplanar rows that extend axially along the core structure or in a coplanar set that extends circumferentially around the core structure. Interconnection between modules is achieved through a backbone interface, through which the modules are connected to the core structure. A large number of variant configurations may be implemented using the modular approach, by selecting a core, components and modules of number and size to meet mission requirements.