Abstract: A singulation saw for sawing either substrate or wafers includes a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternatively engaging with a substrate to be singulated. The singulation saw further includes a transport system including a pair of substrate carriers reciprocates the substrates. While the first substrate is being cut, the second substrate or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate. As the first cut substrate is moved to an unload position, the new uncut substrate is moved into a cutting position.

Abstract: A stray field shielding structure for die attaching onto a magnetic random access memory chip or to other chips to prevent loss of memory due to magnetic fields or radiation is made by a method which provides a thick layer of magnetic material which is precise in its dimensions and adapted for placement on individual die by existing pick and place machines and die attach bonders. The magnetic shielding material is cut to a desired size by etching to remove all burrs and debris and is then attached only to good die using a die attach film of thermoset plastic or a gob of epoxy adhesive.

Abstract: A super abrasive impregnated singulation saw blade is made by depositing grindable friable super abrasive particles while electro depositing or electroless depositing a strong binder metal such as nickel on a form or mandrel. The deposited super abrasive on the upper side protrudes from the side of the blade and are ground down to or near the binder metal to plannerize the sides of the saw blade and true and balance the saw blade. Post operations include electro polishing to expose equal amounts of super abrasive on the cutting edge or on all sides. Antifriction particles may be added in the side walls or deposited on the outside.

Abstract: In a singulation saw for sawing either substrates or wafers there is provided a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternately engaging with a first substrate to be singulated. A transport system comprising a pair of substrate carriers reciprocates the first substrate under the pair of saw blades while alternate ones of the saw blades are engaged to cut the substrate. While the first substrate is being cut, the second or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate.