Patents by Inventor David William Sherrer

David William Sherrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Formulation for packaging an electronic device and assemblies made therefrom
    Patent number: 9337152
    Abstract: Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 10, 2016
    Assignee: Nuvotronics, Inc
    Inventors: David William Sherrer, James D MacDonald
  • Device package and methods for the fabrication thereof
    Patent number: 8969132
    Abstract: Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: March 3, 2015
    Assignee: Nuvotronics, LLC
    Inventors: David William Sherrer, James MacDonald
  • Formulation for Packaging an Electronic Device and Assemblies Made Therefrom
    Publication number: 20140268625
    Abstract: Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: David William Sherrer, James D. MacDonald
  • Device Package and Methods for the Fabrication Thereof
    Publication number: 20120067871
    Abstract: Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 22, 2012
    Inventors: David William Sherrer, James MacDonald