Abstract: Methods, systems, and storage media for projecting multi-viewer-specific 3D object perspectives from a single 3D display are disclosed. Implementations may: acquire face and eye region image data of a plurality of viewers within a field of view of at least one camera associated with a 3D-enabled digital display; analyze the eye region image data to determine at least one 3D eye position, at least one eye state, at least one gaze angle, and at least one point-of-regard for at least one viewer relative to at least one camera associated with the 3D-enabled digital display; and calculate a plurality of image projections for display by the single 3D display.

Abstract: Methods, systems, and storage media for projecting multi-viewer-specific 3D object perspectives from a single 3D display are disclosed. Implementations may: acquire face and eye region image data of a plurality of viewers within a field of view of at least one camera associated with a 3D-enabled digital display; analyze the eye region image data to determine at least one 3D eye position, at least one eye state, at least one gaze angle, and at least one point-of-regard for at least one viewer relative to at least one camera associated with the 3D-enabled digital display; and calculate a plurality of image projections for display by the single 3D display.

Abstract: Methods, systems, and storage media for projecting multi-viewer-specific 3D object perspectives from a single 3D display are disclosed. Implementations may: acquire face and eye region image data of a plurality of viewers within a field of view of at least one camera associated with a 3D-enabled digital display; analyze the eye region image data to determine at least one 3D eye position, at least one eye state, at least one gaze angle, and at least one point-of-regard for at least one viewer relative to at least one camera associated with the 3D-enabled digital display; and calculate a plurality of image projections for display by the single 3D display.

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Abstract: The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Abstract: Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Abstract: A method and apparatus for removing contaminants from the surface of a substrate. An explosive medium is introduced into a vicinity of the substrate, and a beam of electromagnetic energy is directed toward the substrate. Absorption of the electromagnetic energy causes the explosive medium both to generate a blast wave and to form reactive species, the blast wave and the reactive species cooperating to remove the contaminants from the surface substantially without damage to the surface itself.

Abstract: Apparatus for semiconductor device fabrication, includes at least one lithography station, which is adapted to project a pattern of radiation from a mask onto a semiconductor wafer. A mask cleaning station is adapted to receive the mask from the at least one lithography station, to clean the mask so as to remove a contaminant therefrom, and so that the cleaned mask may be returned to the at least one lithography station. A robot is adapted to convey the mask between the at least one lithography station and the mask cleaning station. An enclosure contains the at least one lithography station, the mask cleaning station and the robot, so that the mask is conveyed between the at least one lithography station and the mask cleaning station without human contact and without exposure to ambient air.

Abstract: Apparatus for cleaning a surface of a substrate includes a cooling device, which is adapted to cool a region of the substrate in a vicinity of a particle on the surface, so as to cause a fluid in contact with the surface to form a frozen film in the vicinity of the particle. A radiation source is adapted to direct a beam of energy toward the surface so as to cause vaporization of the film due to absorption of the beam in the film, thereby facilitating removal of the particle from the surface.

Abstract: Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Abstract: Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Abstract: Apparatus for semiconductor device fabrication, includes at least one lithography station, which is adapted to project a pattern of radiation from a mask onto a semiconductor wafer. A mask cleaning station is adapted to receive the mask from the at least one lithography station, to clean the mask so as to remove a contaminant therefrom, and so that the cleaned mask may be returned to the at least one lithography station. A robot is adapted to convey the mask between the at least one lithography station and the mask cleaning station. An enclosure contains the at least one lithography station, the mask cleaning station and the robot, so that the mask is conveyed between the at least one lithography station and the mask cleaning station without human contact and without exposure to ambient air.

Abstract: Apparatus and method for cleaning of a substrate by a homogenized and de-polarized radiation beam, the apparatus includes: (i) a radiation source which is adapted to emit a non-homogenized and polarized radiation beam toward a de-polarizer and homogenizer; (ii) a de-polarizer and homogenizer, for converting the non-homogenized and polarized radiation beam to a homogenized and de-polarized radiation beam; and (iii) optics, for directing the homogenized and de-polarized radiation beam towards the substrate.

Abstract: This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these particles have a dimension of less than approximately one micron. A suction force is applied in the vicinity of the surface after applying the fluid so as to remove from the surface the majority of those particles having the dimension of less than approximately one micron.

Abstract: Apparatus for cleaning a surface of a substrate includes a cooling device, which is adapted to cool a region of the substrate in a vicinity of a particle on the surface, so as to cause a fluid in contact with the surface to form a frozen film in the vicinity of the particle. A radiation source is adapted to direct a beam of energy toward the surface so as to cause vaporization of the film due to absorption of the beam in the film, thereby facilitating removal of the particle from the surface.

Abstract: Apparatus for semiconductor device fabrication, includes at least one lithography station, which is adapted to project a pattern of radiation from a mask onto a semiconductor wafer. A mask cleaning station is adapted to receive the mask from the at least one lithography station, to clean the mask so as to remove a contaminant therefrom, and so that the cleaned mask may be returned to the at least one lithography station. A robot is adapted to convey the mask between the at least one lithography station and the mask cleaning station. An enclosure contains the at least one lithography station, the mask cleaning station and the robot, so that the mask is conveyed between the at least one lithography station and the mask cleaning station without human contact and without exposure to ambient air.

Abstract: A method and apparatus for removing contaminants from the surface of a substrate. An explosive medium is introduced into a vicinity of the substrate, and a beam of electromagnetic energy is directed toward the substrate. Absorption of the electromagnetic energy causes the explosive medium both to generate a blast wave and to form reactive species, the blast wave and the reactive species cooperating to remove the contaminants from the surface substantially without damage to the surface itself.

Abstract: A method and apparatus for removing contaminants from the surface of a substrate. An explosive medium is introduced into a vicinity of the substrate, and a beam of electromagnetic energy is directed toward the substrate. Absorption of the electromagnetic energy causes the explosive medium both to generate a blast wave and to form reactive species, the blast wave and the reactive species cooperating to remove the contaminants from the surface substantially without damage to the surface itself.

Abstract: Particles are removed from the surface of a substrate. Respective position coordinates of the particles on the surface are determined. A beam of electromagnetic energy is directed at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Abstract: This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these particles have a dimension of less than approximately one micron. A suction force is applied in the vicinity of the surface after applying the fluid so as to remove from the surface the majority of those particles having the dimension of less than approximately one micron.