Patents by Inventor Davide Simone

Davide Simone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180266228
    Abstract: A method of extracting hydrocarbons from a wellbore formed in a subterranean rock formation. The wellbore includes at least one fracture extending therefrom. The method includes forming a particle-free treatment fluid that includes an uncured, particle-free proppant material, and injecting the particle-free treatment fluid into the wellbore and towards the at least one fracture. The uncured, particle-free proppant material is configured to cure in-situ when positioned within the at least one fracture.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Inventors: Andrew Jacob Gorton, Mark H. Holtz, Bill James Johnson, Venkat Subramaniam Venkataramani, John Thomas Leman, Peter John Bonitatibus, JR., Davide Simone
  • Publication number: 20070284758
    Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.
    Type: Application
    Filed: May 22, 2006
    Publication date: December 13, 2007
    Applicant: General Electric Company
    Inventors: Jian Zhang, Davide Simone, Christopher Carter, Laura Meyer, Charles Becker, Florian Schattenmann, Sandeep Tonapi, Slawomir Rubinsztajn, Christopher Keimel
  • Publication number: 20070131912
    Abstract: The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.
    Type: Application
    Filed: July 8, 2005
    Publication date: June 14, 2007
    Inventors: Davide Simone, Thomas Angeliu, Sandeep Tonapi, David Gibson, Jian Zhang
  • Publication number: 20060094809
    Abstract: The instant invention provides for an electrically and thermally conductive silicone adhesive composition comprising an alkenyl siloxane, a hydrido-siloxane, an electrically and thermally conductive filler, an optional thermally conductive filler, an adhesion promoter that does not deactivate the hydrosilylation catalyst, and a hydrosilylation catalyst and a hydrosilylation catalyst inhibitor.
    Type: Application
    Filed: March 11, 2005
    Publication date: May 4, 2006
    Inventors: Davide Simone, Larry Lewis, Shahid Murtuza
  • Publication number: 20060045838
    Abstract: A nanostructure having at least one nanotube and at least one chemical moiety non-covalently attached to the at least one nanotube. At least one dendrimer is bonded to the chemical moiety. The chemical moiety may include soluble polymers, soluble oligomers, and combinations thereof. A method of dispersing at least one nanotube is also described. The method includes providing at least one nanotube and at least one chemical moiety to a solvent; debundling the nanotube; and non- covalently attaching a chemical moiety to the nanotube, wherein the non-covalently attached chemical moiety disperses the nanotube. A method of separating at least one semi-conducting carbon nanotube is also described.
    Type: Application
    Filed: August 24, 2004
    Publication date: March 2, 2006
    Inventors: Patrick Lucien Malenfant, Walter Cicha, Pierre-Andre Bui, Davide Simone
  • Publication number: 20050045855
    Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.
    Type: Application
    Filed: September 3, 2003
    Publication date: March 3, 2005
    Inventors: Sandeep Tonapi, Hong Zhong, Davide Simone, Raymond Fillion