Patents by Inventor Dawit Solomon

Dawit Solomon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Components for housing an integrated circuit device
    Patent number: 5578869
    Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
    Type: Grant
    Filed: March 29, 1994
    Date of Patent: November 26, 1996
    Assignee: Olin Corporation
    Inventors: Paul R. Hoffman, Deepak Mahulikar, George A. Brathwaite, Dawit Solomon, Arvind Parthasarathi