Patents by Inventor Dayln Keith Beazer

Dayln Keith Beazer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireline deployed multi-stage stimulation and fracturing system
    Patent number: 10597964
    Abstract: A multi-stage stimulating system is provided. The system is wireline deployed comprises one or more hydraulic sealing devices, hydraulic anchors and a mechanical cutter or a shifting tool, further comprising an accumulator-pump unit in the system to provide a fluid source for hydraulically actuating the sealing devices, anchors and cutter. A method is further provided of stimulating multiple intervals of a subterranean formation by running a bottom hole assembly down a wellbore casing on a wireline.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: March 24, 2020
    Inventors: Dayln Keith Beazer, Paul Bernard Lee, Sean Patrick Grant Hervo
  • Wireline Deployed Multi-Stage Stimulation and Fracturing System
    Publication number: 20190186224
    Abstract: A multi-stage stimulating system is provided. The system is wireline deployed comprises one or more hydraulic sealing devices, hydraulic anchors and a mechanical cutter or a shifting tool, further comprising an accumulator-pump unit in the system to provide a fluid source for hydraulically actuating the sealing devices, anchors and cutter. A method is further provided of stimulating multiple intervals of a subterranean formation by running a bottom hole assembly down a wellbore casing on a wireline.
    Type: Application
    Filed: March 2, 2018
    Publication date: June 20, 2019
    Inventors: Dayln Keith Beazer, Paul Bernard Lee, Sean Patrick Grant Hervo