Abstract: A system and method is provided for dynamically controlling output voltage slew rate in a power converter. Preferred embodiments of the present invention operate in accordance with a power converter including at least a slew-rate control lead (a trim lead, a control lead, etc.), an error-amplifier circuit located therein, a slew-rate circuit, and a controller electrically connected to the power converter and adapted to dynamically control the converter's output voltage slew rate through the transmission of a slew-rate signal. In one embodiment of the present invention, the slew-rate circuit is external to the power converter and electrically connected to both a trim lead of the power converter and to the controller. In another embodiment of the present invention, the slew-rate circuit is internal to the power converter and electrically connected to both a control lead of the power converter and to the error-amplifier circuit.

Abstract: A system and method is provided for dynamically controlling output voltage slew rate in a power converter. Preferred embodiments of the present invention operate in accordance with a power converter including at least a slew-rate control lead (a trim lead, a control lead, etc.), an error-amplifier circuit located therein, a slew-rate circuit, and a controller electrically connected to the power converter and adapted to dynamically control the converter's output voltage slew rate through the transmission of a slew-rate signal. In one embodiment of the present invention, the slew-rate circuit is external to the power converter and electrically connected to both a trim lead of the power converter and to the controller. In another embodiment of the present invention, the slew-rate circuit is internal to the power converter and electrically connected to both a control lead of the power converter and to the error-amplifier circuit.

Abstract: A system and method is provided for dynamically controlling output voltage slew rate in a power converter. Preferred embodiments of the present invention operate in accordance with a power converter including at least a slew-rate control lead (a trim lead, a control lead, etc.), an error-amplifier circuit located therein, a slew-rate circuit, and a controller electrically connected to the power converter and adapted to dynamically control the converter's output voltage slew rate through the transmission of a slew-rate signal. In one embodiment of the present invention, the slew-rate circuit is external to the power converter and electrically connected to both a trim lead of the power converter and to the controller. In another embodiment of the present invention, the slew-rate circuit is internal to the power converter and electrically connected to both a control lead of the power converter and to the error-amplifier circuit.

Abstract: An integrated magnetic assembly that allows the primary and secondary windings of a transformer and a separate inductor winding to be integrated on a unitary magnetic structure is disclosed. The unitary magnetic structure includes first, second, and third legs that are physically connected and magnetically coupled. The primary and secondary windings of the transformer can be formed on the third leg of the unitary magnetic structure. Alternatively, the primary and secondary windings can be split between the first and second legs. Thus, the primary winding includes first and second primary windings disposed on the first and second legs and the secondary winding includes first and second secondary windings disposed on the first and second legs. The inductor winding may also be formed either on the third leg or it may split into first and second inductor windings and disposed on the first and second legs. In addition, one or more legs may include an energy storage component such as an air gap.

Abstract: A pin connector system includes a pin portion having a first cross-sectional geometry, wherein the pin portion passes through a pin passage in a first printed circuit board. The pin passage has a second cross-sectional geometry, wherein the combination of the first and second cross-sectional geometries forms a first solder passage for allowing solder to flow through the first printed circuit board.