Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a source region, a drain region, a first oxide layer, a field plate, and a second oxide layer. The gate structure is disposed on the semiconductor substrate. The source region and the drain region are disposed in the semiconductor substrate and located at two opposite sides of the gate structure respectively. The first oxide layer includes a first portion disposed between the gate structure and the semiconductor substrate and a second portion disposed between the gate structure and the drain region. The field plate is partly disposed above the gate structure and partly disposed above the second portion of the first oxide layer. The second oxide layer includes a first portion disposed between the field plate and the gate structure and a second portion disposed between the field plate and the second portion of the first oxide layer.

Abstract: In some embodiments, an electronic device displays an incoming call user interface in response to receiving an indication of an incoming call. In some embodiments, the incoming call user interface is displayed overlaid on a respective user interface that is optionally associated with an application other than the application associated with the incoming call.

Abstract: A chassis quick release device includes a housing including a base with a connected sliding channel and accommodating space therein and a cover assembled with the base, a locking block linearly movably set in the accommodating space, and an operating handle having a rod body positioned on the sliding channel and a grip assembled with the rod body. The rod body has a cylindrical joint that corresponds to the grip and has a shaft groove defined therein. The grip is provided with a sleeve corresponding to the cylindrical joint and defining therein an accommodating cavity. Moving the operating handle in the direction of the housing causes the locking block to slide out from the accommodating space to form a locked state. Pulling the operating handle away from the housing causes the locking block to move linearly in a second direction to form an unlocked state.

Abstract: Embodiments provide a dielectric inter block disposed in a metallic region of a conductive line or source/drain contact. A first and second conductive structure over the metallic region may extend into the metallic region on either side of the inter block. The inter block can prevent etchant or cleaning solution from contacting an interface between the first conductive structure and the metallic region.

Abstract: Disclosed herein are compounds of Formula (I), or pharmaceutically acceptable salts thereof, that are inhibitors of Polo Like Kinase 4 (PLK4). Also disclosed herein are pharmaceutical compositions comprising the compounds of Formula (I), or pharmaceutically acceptable salts thereof, and one or more pharmaceutically acceptable excipients. Further disclosed herein are methods of treating cancer in a subject in need thereof, comprising administering to the subject an amount of a compound of Formula (I), or a pharmaceutically acceptable salt thereof.

Abstract: Improved conductive contacts, methods for forming the same, and semiconductor devices including the same are disclosed. In an embodiment, a semiconductor device includes a first interlayer dielectric (ILD) layer over a transistor structure; a first contact extending through the first ILD layer, the first contact being electrically coupled with a first source/drain region of the transistor structure, a top surface of the first contact being convex, and the top surface of the first contact being disposed below a top surface of the first ILD layer; a second ILD layer over the first ILD layer and the first contact; and a second contact extending through the second ILD layer, the second contact being electrically coupled with the first contact.

Abstract: An electronic device includes a gamma data source, a signal receiving circuit, a buffer circuit, a counter, a multiplexer, and a gamma processing unit. The signal receiving circuit receives source data, and correspondingly generates a grayscale value. The buffer circuit electrically couples the signal receiving circuit and stores the grayscale value. The counter receives a system clock signal to generate a sequence number. The multiplexer electrically couples the counter and the gamma data source. The multiplexer receives the sequence number. The multiplexer outputs a bit message corresponding to the sequence number in the gamma data source. The gamma processing unit electrically couples the multiplexer and the buffer circuit. The gamma processing unit receives the bit message from the multiplexer. The gamma processing unit receives the grayscale value from the buffer circuit. The gamma processing unit outputs a bit value corresponding to the grayscale value in the bit message.

Abstract: A p-aminobenzoic acid-producing microorganism is provided. The p-aminobenzoic acid-producing microorganism is obtained by a method for preparing a p-aminobenzoic acid-producing microorganism. The method for preparing a p-aminobenzoic acid-producing microorganism includes (a) performing an acclimation process on a source microorganism with at least one sulfonamide antibiotic to obtain at least one acclimatized microorganism and (b) screening out at least one p-aminobenzoic acid-producing microorganism from the at least one acclimatized microorganism, wherein the at least one p-aminobenzoic acid-producing microorganism has a higher p-aminobenzoic acid titer than the source microorganism.

Abstract: A multi-input multi-output antenna system capable of being disposed in an electronic device and the electronic device including the antenna system have a low-frequency antenna assembly and a high-frequency antenna assembly. The low-frequency antenna assembly includes multiple low-frequency antennas that are spaced apart from each other by a distance. The high-frequency antenna assembly includes multiple high-frequency antennas that are spaced apart from each other by a distance. One of the high-frequency antennas is structured as a low-profile dish antenna and is located between the low-frequency antennas, so that the antenna system has smaller volume and height, and better isolation and radiation patterns.

Abstract: The present disclosure generally relates to sharing workout content on electronic devices.

Abstract: The present disclosure generally relates to sharing workout content on electronic devices.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first fin structure. The semiconductor device structure includes a first source/drain structure over the first fin structure. The semiconductor device structure includes a first dielectric layer over the first source/drain structure and the substrate. The semiconductor device structure includes a first conductive contact structure in the first dielectric layer and over the first source/drain structure. The semiconductor device structure includes a second dielectric layer over the first dielectric layer and the first conductive contact structure. The semiconductor device structure includes a first conductive via structure passing through the second dielectric layer and connected to the first conductive contact structure. A first width direction of the first conductive contact structure is substantially parallel to a second width direction of the first conductive via structure.

Abstract: A chassis quick release device includes a housing including a base provided with a sliding channel, a compression space, and accommodating space, a rotating space and a shaft in the rotating space and covered with a cover, a locking block linearly movably set in the accommodating space and providing a guide groove, a guide chamber, a receiving groove and an elastic member set in the receiving groove, a locking member having a shaft hole coupled to the shaft, a rotary reset member positioned on the shaft, resisting edge located at one end thereof that can rotate and protrude from the housing and a locking edge located at the other end thereof, and an operating handle including a rod body positioned in the sliding channel, the guide groove and the guide chamber and mounted with a grp and having a locking portion stopped against the guide chamber.

Abstract: A multi-input multi-output antenna system capable of being disposed in an electronic device and the electronic device including the antenna system have a low-frequency antenna assembly and a high-frequency antenna assembly. The low-frequency antenna assembly includes multiple low-frequency antennas that are spaced apart from each other by a distance. The high-frequency antenna assembly includes multiple high-frequency antennas that are spaced apart from each other by a distance. One of the high-frequency antennas is structured as a low-profile dish antenna and is located between the low-frequency antennas, so that the antenna system has smaller volume and height, and better isolation and radiation patterns.

Abstract: An antenna assembly with compact layout traces includes a circuit board and at least one wireless antenna unit, wherein the circuit board is provided with an antenna module, the at least one wireless antenna unit can be located at the same edge or at different edges of the circuit board, each of the at least one wireless antenna unit includes two antennas of the planar inverted-F antenna (PIFA) structure and a neutralization line, and the two antennas are spaced apart from each other and the two ends of the neutralization line are electrically connected to and overlap the two antennas respectively. By arranging antennas of the same working band along the same edge of the circuit board, the corresponding layout traces can be effectively shortened.

Abstract: A low-profile dual-band high-isolation antenna module is fixed on a substrate and includes two high-frequency antennas and two low-frequency antennas located on two opposite sides of the substrate respectively. The bottom ends of the low-frequency antennas are connected to a grounding of the substrate. A decoupling element is disposed between the high-frequency antennas and the low-frequency antennas. The top end of each high-frequency antenna forms a bent portion, and so does the top end of each low-frequency antenna. The decoupling element has two ends extending to positions corresponding respectively to the low-frequency antennas but is not in contact with the low-frequency antennas or the high-frequency antennas. The bottom end of the decoupling element is connected to the grounding through at least one metal strip. The bent portions effectively reduce the space occupied by the antennas while the decoupling element provides isolation between the antennas.

Abstract: A low-profile dual-band high-isolation antenna module is fixed on a substrate and includes two high-frequency antennas and two low-frequency antennas located on two opposite sides of the substrate respectively. The bottom ends of the low-frequency antennas are connected to a grounding of the substrate. A decoupling element is disposed between the high-frequency antennas and the low-frequency antennas. The top end of each high-frequency antenna forms a bent portion, and so does the top end of each low-frequency antenna. The decoupling element has two ends extending to positions corresponding respectively to the low-frequency antennas but is not in contact with the low-frequency antennas or the high-frequency antennas. The bottom end of the decoupling element is connected to the grounding through at least one metal strip. The bent portions effectively reduce the space occupied by the antennas while the decoupling element provides isolation between the antennas.

Abstract: An antenna assembly with compact layout traces includes a circuit board and at least one wireless antenna unit, wherein the circuit board is provided with an antenna module, the at least one wireless antenna unit can be located at the same edge or at different edges of the circuit board, each of the at least one wireless antenna unit includes two antennas of the planar inverted-F antenna (PIFA) structure and a neutralization line, and the two antennas are spaced apart from each other and the two ends of the neutralization line are electrically connected to and overlap the two antennas respectively. By arranging antennas of the same working band along the same edge of the circuit board, the corresponding layout traces can be effectively shortened.