Patents by Inventor Dean B. Dudley

Dean B. Dudley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible automated bonding method and apparatus
    Patent number: 5127570
    Abstract: A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
    Type: Grant
    Filed: June 28, 1990
    Date of Patent: July 7, 1992
    Assignee: Cray Research, Inc.
    Inventors: Richard R. Steitz, Melvin C. August, Diane M. Christie, Deanna M. Dowdle, Dean B. Dudley, Stephen E. Nelson, Eugene F. Neumann, Paul E. Schroeder