Patents by Inventor Dean C. Hruzek
Dean C. Hruzek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10192765Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: August 11, 2014Date of Patent: January 29, 2019Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Publication number: 20180374725Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.Type: ApplicationFiled: June 23, 2017Publication date: December 27, 2018Inventors: Devendra Channappa Holeyannavar, Sandesh Doddamane Ramappa, Dean C. Hruzek, Michael R. Rice, Jeffrey A. Brodine
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Publication number: 20180366355Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 24, 2018Publication date: December 20, 2018Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
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Patent number: 10159169Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.Type: GrantFiled: October 27, 2016Date of Patent: December 18, 2018Assignee: Applied Materials, Inc.Inventors: Joseph Vincent, Michael Kuchar, Dean C. Hruzek, Vijayabaskar Soundarrajan, Pandu Maddherla, Adam J. Wyatt, Robert M. McAndrew
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Publication number: 20180124960Abstract: An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.Type: ApplicationFiled: October 27, 2016Publication date: May 3, 2018Inventors: Joseph Vincent, Michael Kuchar, Dean C. Hruzek, Vijayabaskar Soundarrajan, Pandu Maddherla, Adam J. Wyatt, Robert M. McAndrew
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Publication number: 20160225646Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: November 3, 2014Publication date: August 4, 2016Inventors: Michael Robert RICE, Michael MEYERS, John J. MAZZOCCO, Dean C. HRUZEK, Michael KUCHAR, Sushant S. KOSHTI, Penchala N. KANKANALA, Eric A. ENGLHARDT
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Publication number: 20160147235Abstract: Electronic device processing systems including environmental control of the factory interface, a carrier purge chamber, and one or more substrate carriers are described. One electronic device processing system has a factory interface having a factory interface chamber, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface, the carrier purge chamber, and the one or more substrate carriers and operational to control an environment at least within the factory interface chamber, carrier purge chamber, and the one or more substrate carriers. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: November 3, 2015Publication date: May 26, 2016Inventors: Michael R. Rice, Dean C. Hruzek
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Publication number: 20150311102Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.Type: ApplicationFiled: April 17, 2015Publication date: October 29, 2015Inventors: Eran Weiss, Travis Morey, Nir Merry, Paul B. Reuter, Izya Kremerman, Jeffrey C. Hudgens, Dean C. Hruzek
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Patent number: 9147592Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.Type: GrantFiled: August 7, 2013Date of Patent: September 29, 2015Assignee: Applied Materials, Inc.Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
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Publication number: 20150098773Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: APPLIED MATERIALS, INC.Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk VAN KATWYK, Van HOSKINS, Vinay SHAH
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Publication number: 20150045961Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 11, 2014Publication date: February 12, 2015Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten
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Patent number: 8911193Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: GrantFiled: November 28, 2011Date of Patent: December 16, 2014Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20140044503Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.Type: ApplicationFiled: August 7, 2013Publication date: February 13, 2014Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
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Patent number: 8599531Abstract: Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.Type: GrantFiled: January 8, 2010Date of Patent: December 3, 2013Assignee: Applied Materials, Inc.Inventors: Satish Sundar, Jeffrey C. Hudgens, Prudhvi R. Chintalapati, William Nixon Taylor, Jr., William P. Laceky, Jeffrey A. Brodine, Dean C. Hruzek, Mario Dave Silvetti
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Publication number: 20120141237Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: November 28, 2011Publication date: June 7, 2012Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk Van KATWYK, Van HOSKINS, Vinay SHAH
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Patent number: 8066466Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: GrantFiled: July 20, 2010Date of Patent: November 29, 2011Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20100280654Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: ApplicationFiled: July 20, 2010Publication date: November 4, 2010Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7798764Abstract: A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.Type: GrantFiled: October 27, 2006Date of Patent: September 21, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20100178139Abstract: Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.Type: ApplicationFiled: January 8, 2010Publication date: July 15, 2010Applicant: Applied Materials, Inc.Inventors: Satish Sundar, Jeffrey C. Hudgens, Prudhvi R. Chintalapati, William Nixon Taylor, JR., William P. Laceky, Jeffrey A. Brodine, Dean C. Hruzek, Mario Dave Silvetti
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Patent number: 7651306Abstract: Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.Type: GrantFiled: December 22, 2005Date of Patent: January 26, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah