Patents by Inventor Deanna J. Wright

Deanna J. Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clean release, phase change thermal interface
    Patent number: 6835453
    Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: December 28, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: Alfred W. Greenwood, Michael H. Bunyan, Kent M. Young, Deanna J. Wright
  • Clean release tape for EMI shielding
    Publication number: 20030091777
    Abstract: An EMI shielding tape adherable to a surface of a structure. The tape includes a backing layer, and an adhesive layer carried on at least one side of the backing layer. The adhesive layer has an inner face bonded the backing layer, and an opposite outer face which is bondable under pressure to the structure surface to adhere the tape thereto. The adhesive layer is formulated as an admixture of a pressure sensitive adhesive (PSA) composition and one or more electrically-conductive particulate fillers. When adhered to the structure surface, the tape is substantially cleanly releasable therefrom.
    Type: Application
    Filed: June 20, 2002
    Publication date: May 15, 2003
    Inventors: Peter Jones, Deanna J. Wright, Robert J. Malik
  • Clean release, phase change thermal interface
    Publication number: 20020135984
    Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
    Type: Application
    Filed: January 14, 2002
    Publication date: September 26, 2002
    Inventors: Alfred W. Greenwood, Michael H. Bunyan, Kent M. Young, Deanna J. Wright