Patents by Inventor Deborah Anne Sylvester

Deborah Anne Sylvester has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for cooling semiconductor integrated circuit package structures
    Patent number: 7803664
    Abstract: The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: September 28, 2010
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, Gary Goth, Deborah Anne Sylvester, Jeffrey Allen Zitz
  • Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures
    Publication number: 20080242002
    Abstract: The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.
    Type: Application
    Filed: May 5, 2008
    Publication date: October 2, 2008
    Inventors: Evan George Colgan, Gary Goth, Deborah Anne Sylvester, Jeffrey Allen Zitz
  • Apparatus and methods for cooling semiconductor integrated circuit package structures
    Patent number: 7394659
    Abstract: The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: July 1, 2008
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, Gary Goth, Deborah Anne Sylvester, Jeffrey Allen Zitz