Patents by Inventor Deborah Derfelt Forray

Deborah Derfelt Forray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • B-stageable die attach adhesives
    Patent number: 7851254
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: December 14, 2010
    Assignee: Henkel Corporation
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • B-STAGEABLE DIE ATTACH ADHESIVES
    Publication number: 20080160315
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: February 9, 2007
    Publication date: July 3, 2008
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • B-stageable die attach adhesives
    Patent number: 7176044
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: February 13, 2007
    Assignee: Henkel Corporation
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • Highly conductive resin compositions
    Publication number: 20040225045
    Abstract: The present invention relates to resin compositions, particularly those having a high degree of conductivity. In particular, the present invention relates to highly conductive die attach compositions useful for attaching semiconductor devices to carrier substrates. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: May 5, 2003
    Publication date: November 11, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventor: Deborah Derfelt Forray
  • B-stageable die attach adhesives
    Publication number: 20040102566
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: June 12, 2003
    Publication date: May 27, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos