Abstract: An FPC connector includes a first insulating layer, a first circuit layer, a second insulating layer, a third insulating layer, and a second circuit layer. The first circuit layer is arranged between the first insulating layer and the second insulating layer. The first circuit layer includes a number of conductive strips. The third insulating layer is arranged between the first insulating layer and the first circuit layer. The second circuit layer includes a number of conductive strips provided on an upper side of the third insulating layer. Ends of the conductive strips of the second circuit layer pass through the third insulating layer and are correspondingly connected to the conductive strips of the first circuit layer. The first circuit layer and the second insulating layer each has a forepart extending beyond a front end of each of the first insulating layer, the third insulating layer, and the second circuit layer.

Abstract: An FPC connector includes a first insulating layer, a first circuit layer, a second insulating layer, a third insulating layer, and a second circuit layer. The first circuit layer is arranged between the first insulating layer and the second insulating layer. The first circuit layer includes a number of conductive strips. The third insulating layer is arranged between the first insulating layer and the first circuit layer. The second circuit layer includes a number of conductive strips provided on an upper side of the third insulating layer. Ends of the conductive strips of the second circuit layer pass through the third insulating layer and are correspondingly connected to the conductive strips of the first circuit layer. The first circuit layer and the second insulating layer each has a forepart extending beyond a front end of each of the first insulating layer, the third insulating layer, and the second circuit layer.

Abstract: The present application relates to an FPC connector, comprising a first insulating layer, a first circuit layer comprising a plurality of conductive strips, and a second insulating layer, wherein the first circuit layer and the second insulating layer each has a forepart extending beyond a front end of the first insulating layer; the first circuit layer comprises a plurality of conductive strips having foreparts arranged in parallel at equal intervals, a metal layer is plated with or deposited on the foreparts of the first circuit layer, the metal layer and the foreparts of the first circuit layer constitute metal fingers; conductive strips on other circuit layers connect to the conductive strips of the layer by vias and metallic coating or deposition. A position located at a bottom of the FPC corresponding to the metal fingers is covered by a layer of reinforcing plate.

Abstract: The present application relates to an FPC connector, comprising a first insulating layer, a first circuit layer comprising a plurality of conductive strips, and a second insulating layer, wherein the first circuit layer and the second insulating layer each has a forepart extending beyond a front end of the first insulating layer; the first circuit layer comprises a plurality of conductive strips having foreparts arranged in parallel at equal intervals, a metal layer is plated with or deposited on the foreparts of the first circuit layer, the metal layer and the foreparts of the first circuit layer constitute metal fingers; conductive strips on other circuit layers connect to the conductive strips of the layer by vias and metallic coating or deposition. A position located at a bottom of the FPC corresponding to the metal fingers is covered by a layer of reinforcing plate.

Abstract: From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-?0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal.

Abstract: From tungsten or molybdenum powders, a tungsten or molybdenum compact is pressurized and molded into the same dimensions as or slightly larger than the end product and sintered into tungsten or molybdenum skeleton. After copper infiltration, chemical copper etching is applied to remove excess surface copper. A machining allowance with an absolute value >0-?0.1 mm may be applied for the machining of uneven surfaces resulting from the chemical process of copper removal.