Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water.

Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water. According to another embodiment, a vaporized portion of a liquid reducing agent is mixed with the halogen-containing gas to produce a reaction mixture and a non-thermal plasma is generated in the reaction gas mixture to reduce the halogen-containing gas.

Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water.

Abstract: A low-loss electrode-printed structural dielectric barrier for a non-thermal plasma reactor and non-thermal plasma multi-cell stacks having low-loss electrodes. The low-loss electrode-printed structural dielectric barriers include a structural dielectric barrier having a first side and a second opposite side; a low-loss electrode pattern disposed on the second side of the structural dielectric barrier; the low-loss electrode pattern comprising first and second major electrode sections that are offset from any ribs, supports, ligaments, spacers, tines, or other structure that serves as a structural dielectric connection between dielectric barriers in a multi-cell stack, a connector disposed between and electrically connecting the first and second major electrode sections and offset relative to a centerline perpendicular to the rib orientation, and a bus path connector electrically connected to one of the major electrode sections and offset relative to the centerline.

Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water.

Abstract: A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to form a structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others. In one embodiment, the dielectric barrier layer includes a coating applied to the base conductor support. In another embodiment, the dielectric barrier layer includes a high k film laminated to the base conductor support. In yet another embodiment, the base conductor support integrally forms the dielectric barrier layer via conversion of surfaces of the base conductor using electrochemical, thermal or chemical means to form the dielectric barrier layer.

Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water. According to another embodiment, a vaporized portion of a liquid reducing agent is mixed with the halogen-containing gas to produce a reaction mixture and a non-thermal plasma is generated in the reaction gas mixture to reduce the halogen-containing gas.

Abstract: There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2 that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water.

Abstract: A low-loss electrode-printed structural dielectric barrier for a non-thermal plasma reactor and non-thermal plasma multi-cell stacks having low-loss electrodes. The low-loss electrode-printed structural dielectric barriers include a structural dielectric barrier having a first side and a second opposite side; a low-loss electrode pattern disposed on the second side of the structural dielectric barrier; the low-loss electrode pattern comprising first and second major electrode sections that are offset from any ribs, supports, ligaments, spacers, tines, or other structure that serves as a structural dielectric connection between dielectric barriers in a multi-cell stack, a connector disposed between and electrically connecting the first and second major electrode sections and offset relative to a centerline perpendicular to the rib orientation, and a bus path connector electrically connected to one of the major electrode sections and offset relative to the centerline.

Abstract: A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to forma structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others.

Abstract: An apparatus contains a fluidized bed that includes particles of different triboelectrical types, each particle type acquiring an opposite polarity upon contact. The contact may occur between particles of the two types or between particles of etiher type and structure or fluid present in the apparatus. A fluidizing gas flow is passed through the particles to produce the fluidized bed. Immersed within the bed are electrodes. An alternating EMF source connected to the electrodes applies an alternating electric field across the fluidized bed to cause particles of the first type to move relative to particles of the second type and relative to the gas flow. In a heat exchanger incorporating the apparatus, the electrodes are conduits conveying a fluid to be heated. The two particle types alternately contact each conduit to transfer heat from a hot gas flow to the second fluid within the conduit.