Patents by Inventor Delilah F. Adams

Delilah F. Adams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic dissipative surface coating and high temperature label employing same
    Patent number: 10689548
    Abstract: An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Polyonics, Inc.
    Inventors: Kenneth T. Robichaud, Donald P. Nieratko, Delilah F. Adams, Robert H. Guyette, Jr.
  • ELECTROSTATIC DISSIPATIVE SURFACE COATING AND HIGH TEMPERATURE LABEL EMPLOYING SAME
    Publication number: 20180208801
    Abstract: An electrostatic dissipative coating composition comprises a phenoxy-epoxy resin system comprising from 40-80 parts by weight to 5-20 parts by weight of an epoxy resin. Carbon nanotubes are dispersed in the phenoxy-epoxy resin system. The coating composition includes at least one isocyanate crosslinking agent and at least one metal catalyst. In a further aspect, a label construction comprising the electrostatic dissipative coating composition is provided.
    Type: Application
    Filed: January 17, 2018
    Publication date: July 26, 2018
    Inventors: Kenneth T. Robichaud, Donald P. Nieratko, Delilah F. Adams, Robert H. Guyette, JR.
  • HIGH TEMPERATURE RESISTANT PRESSURE SENSITIVE ADHESIVE WITH LOW THERMAL IMPEDANCE
    Publication number: 20180134925
    Abstract: A high temperature resistant thermally conductive pressure sensitive adhesive composition comprising a first silicon resin, a second silicon resin, a first thermally conductive filler, a second thermally conductive filler, a catalytically effective amount of a curing agent, an optional defoaming agent, and an optional drying agent, wherein said thermally conductive filler has a volume weighted mean particle size in the range of 8 to 20 ?m.
    Type: Application
    Filed: November 9, 2017
    Publication date: May 17, 2018
    Inventors: Delilah F. Adams, Robert H. Guyette, JR., Donald P. Nieratko