Abstract: A subsystem configured to write data to a static random access memory cell employs a single N-channel MOS device connected to ground in each leg of the bi-stable memory cell to overdrive the stored data. The subsystem implements the dual control required to effect matrix operation of the SRAM cell in the gate circuit of the single N-channel MOS device in the drive path. Specifically, the column select signal controls a semiconductor junction that interrupts the data connection to the gate. In this manner, the column select control is removed from the drive path, thus increasing drive strength. Further, a second semiconductor junction connects the gate of the single NMOS device in the drive path when the gate signal is interrupted.

Abstract: A subsystem configured to write data to a static random access memory cell employs a single N-channel MOS device connected to ground in each leg of the bi-stable memory cell to overdrive the stored data. The subsystem implements the dual control required to effect matrix operation of the SRAM cell in the gate circuit of the single N-channel MOS device in the drive path. Specifically, the column select signal controls a semiconductor junction that interrupts the data connection to the gate. In this manner, the column select control is removed from the drive path, thus increasing drive strength. Further, a second semiconductor junction connects the gate of the single NMOS device in the drive path when the gate signal is interrupted.

Abstract: A subsystem configured to write data to a static random access memory cell employs a single N-channel MOS device connected to ground in each leg of the bi-stable memory cell to overdrive the stored data. The subsystem implements the dual control required to effect matrix operation of the SRAM cell in the gate circuit of the single N-channel MOS device in the drive path. Specifically, the column select signal controls a semiconductor junction that interrupts the data connection to the gate. In this manner, the column select control is removed from the drive path, thus increasing drive strength. Further, a second semiconductor junction connects the gate of the single NMOS device in the drive path when the gate signal is interrupted.

Abstract: A static random-access memory (SRAM) module includes a column select (RSEL) driver coupled to an input/output (I/O) circuit by an RSEL line. The I/O circuit is configured to read bit line signals from a bit cell within the SRAM module. During a read operation, the RSEL driver pulls the RSEL line to zero in order to cause p-type metal-oxide-semiconductors (PMOSs) within the I/O circuit to sample the bit line signals output by the bit cell. In response, an aggressor driver drives the RSEL line to a negative voltage, thereby reducing the resistance of the PMOSs within the I/O circuit.

Abstract: A static random-access memory (SRAM) module includes a column select (RSEL) driver coupled to an input/output (I/O) circuit by an RSEL line. The I/O circuit is configured to read bit line signals from a bit cell within the SRAM module. During a read operation, the RSEL driver pulls the RSEL line to zero in order to cause p-type metal-oxide-semiconductors (PMOSs) within the I/O circuit to sample the bit line signals output by the bit cell. In response, an aggressor driver drives the RSEL line to a negative voltage, thereby reducing the resistance of the PMOSs within the I/O circuit.