Patents by Inventor Dengfeng Li

Dengfeng Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135069
    Abstract: The present disclosure provides a risk assessment method of water inrush in tunnels constructed in water-rich grounds. The method includes the following steps: simulating a tunnel excavation process by finite element software MIDAS GTS NX and fluid-structure interaction; according to a research method of control variables, analyzing effects of a groundwater level, an elastic modulus and advanced pipe shed grouting on the stability of surrounding rock, and improving an algorithm of a radial basis function (RBF) neural network using a Grey Relation Analysis (GRA)-based Partitioning Around Medoid (PAM) clustering algorithm to assess risks of water inrush occurring in Qingdao area.
    Type: Application
    Filed: February 21, 2023
    Publication date: April 25, 2024
    Inventors: Yongjun ZHANG, Fei LIU, Huangshuai XIA, Bin GONG, Sijia LIU, Yingming WU, Qingsong WANG, Hongzhi LIU, Ruiquan LU, Mingdong YAN, Lijun ZHANG, Xiaoming GUAN, Pingan WANG, Shuguang LI, Dengfeng YANG, Weiguo ZHANG
  • Patent number: 11968766
    Abstract: An induction heating system for a silicon steel core with a self-adhesive coating that includes an induction heating device having a columnar induction heating coil with a hollow cavity that carries out induction heating on a silicon steel plate at a medium frequency of 6-20 KHz. By rapid induction heating at a medium frequency, a silicon steel core with a self-adhesive coating can be rapidly cured, thereby greatly shortening the processing time, improving production efficiency, and facilitating automated operation in the production of a silicon steel core with a self-adhesive coating. The system also ensures the quality of the cured core products that can be widely applied in the field of the production of silicon steel cores with a self-adhesive coating.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: April 23, 2024
    Assignee: BAOSHAN IRON & STEEL CO. LTD.
    Inventors: Xiaoli Jin, Dengfeng Li, Yueming Zhou, Bo Wang, Guobao Li
  • Publication number: 20240117397
    Abstract: A method for extraction and multi-scenario utilization of flaxseed protein-polysaccharide natural mixture is disclosed, comprising:(1) raw material pretreatment; (2) extraction of mixture I; (3) multi-scenario utilization of mixture I; (4) extraction of mixture II; and (5) multi-scenario utilization of mixture II. Compared with the traditional extraction mode (such as alkali-solution and acid-isolation method) of flaxseed protein, the method of the invention can enrich the flaxseed protein more efficiently, greenly and moderately, and can co-extract polysaccharide from flaxseed meal to form the flaxseed protein-polysaccharide natural mixture. Physical field/bio-enzyme coupling ultrasonic technique solves the bottleneck problem of low extraction rate of the flaxseed protein-polysaccharide natural mixture by water extraction method.
    Type: Application
    Filed: August 31, 2023
    Publication date: April 11, 2024
    Inventors: QIANCHUN DENG, DENGFENG PENG, KANGYU LI, JIAQI SHAO, JIETING YE
  • Publication number: 20240110479
    Abstract: The present disclosure provides a multi-factor quantitative analysis method for deformation of a neighborhood tunnel. The method includes the following steps: analyzing monitoring data generated at a tunnel site; simulating collapse occurring at a shallow buried section of a tunnel; determining the degree of influence of each factor on the tunnel and a stratum; and determining quantitative influence of each factor on tunnel deformation. The present disclosure can not only provide an accurate theoretical basis for the construction of the shallow buried section of the small-distance tunnel, but also guarantee safety and cost saving during tunnel construction.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Inventors: Yongjun ZHANG, Fei LIU, Sijia LIU, Junyi WANG, Bin GONG, Yingming WU, Ruiquan LU, Qingsong WANG, Qinghui XU, Xiaoming GUAN, Mingdong YAN, Xiangyang NI, Pingan WANG, Shuguang LI, Lin YANG, Ning NAN, Dengfeng YANG
  • Publication number: 20240098370
    Abstract: A pan-tilt-zoom device includes a housing, a carrier, an image sensor, and a shape memory alloy (SMA) motor. An accommodating cavity is formed in the housing, and a first opening in communication with the accommodating cavity is provided on the housing. The carrier is located in the accommodating cavity, the carrier has a lens mounting hole, and an opening at one end of the lens mounting hole faces the first opening. The image sensor is located in the accommodating cavity and is disposed on a side that is of the carrier and that is away from the first opening, and a photosensitive surface of the image sensor faces an opening at the other end of the lens mounting hole. The SMA motor is configured to drive the carrier to tilt in the accommodating cavity along with the image sensor in any direction around, to implement optical image stabilization.
    Type: Application
    Filed: December 29, 2021
    Publication date: March 21, 2024
    Inventors: Dengfeng Li, Zhongcheng You, Haibo Wan, Gang Wang
  • Publication number: 20240088748
    Abstract: This application provides a driving apparatus and an electronic device. The driving apparatus may be applied to the electronic device. The driving apparatus includes a variable aperture. A piezoelectric ceramic of the variable aperture is configured to deform under signal control, to drive a rotation ring of the variable aperture to rotate relative to a base of the variable aperture. Each blade of the variable aperture rotates relative to the rotation ring and slides relative to a first protrusion part of the base, and a hole diameter of an aperture hole of the variable aperture changes. A change range of the aperture hole of the variable aperture in this application is not easily affected by an external magnetic force of the variable aperture.
    Type: Application
    Filed: January 26, 2022
    Publication date: March 14, 2024
    Inventors: Xinxiu Bian, Dengfeng Li, Ang Ji
  • Publication number: 20240061317
    Abstract: This application provides a camera module and an electronic device, and relates to the field of electronic device technologies. The camera module includes an optical camera lens, a variable aperture, and an SMA motor. The variable aperture has an aperture hole whose size is adjustable. The SMA motor includes a first carrier, a base, and an SMA drive assembly. The optical camera lens is fastened to the first carrier. The SMA drive assembly is connected between the first carrier and the base. The SMA drive assembly is configured to drive the first carrier, the optical camera lens, and the variable aperture to move together relative to the base, so as to implement automatic focusing and/or optical image stabilization.
    Type: Application
    Filed: December 13, 2021
    Publication date: February 22, 2024
    Inventors: Zhongcheng You, Dengfeng Li, Haibo Wan, Gang Wang, Shixin Qin, Xiaohan Liu
  • Patent number: 11899685
    Abstract: Authorization is divided between a control plane and a data plane for sharing database data. A producer database engine can create a shared database via a data plane interface. A producer can then authorize access to the shared database via a control plane interface to a consumer. A consumer can associate the authorization granted to the consumer with a consumer database engine via the control plane interface.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: February 13, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Ippokratis Pandis, Jingyi Qing, Dengfeng Li, Pavel Sokolov, Eric Ray Hotinger, Mohammad Foyzur Rahman, William Michael McCreedy, Wenchuan An, Vivek Ramamoorthy, Chenqin Xu, Maximiliano Maccanti
  • Publication number: 20230422634
    Abstract: A method and system for preparing a Josephson junction is disclosed, relates to the technical field of micro-nano processing. The method includes: preparing a circuit structure on a substrate by nano-imprinting, the circuit structure comprising a first lead, a second lead, and a peripheral circuit connected to the first and second leads; preparing a photoresist-based undercut structure on the substrate; the undercut structure comprising a first region and a second region having upper photoresist layers and lower layers of hollow-out; the second region being an opening region of the undercut structure; preparing an oxide layer on a surface of the second lead which is not covered by the photoresist; evaporating a first superconducting layer obliquely in a direction from the first region to the second region to obtain the Josephson junction; and evaporating a second superconducting layer obliquely in a direction from the second region to the first region.
    Type: Application
    Filed: August 14, 2023
    Publication date: December 28, 2023
    Inventors: Dengfeng LI, Wenlong ZHANG, Maochun DAI, Kunliang BU
  • Publication number: 20230419148
    Abstract: This application provides a method for preparing a quantum chip. The method includes the following steps: determining an initial eigenfrequency of a chip substrate; performing, based on a numerical comparison result between the initial eigenfrequency and a quantum operating frequency, pattern etching on a first surface of the chip substrate to obtain a chip substrate with an intact second surface and the first surface with a target pattern, wherein the quantum operating frequency is an operating frequency of a quantum bit of a quantum circuit, the second surface is opposite to the first surface, and the target pattern is a pattern when a difference between the initial eigenfrequency of the chip substrate and the quantum operating frequency is maximum; and etching, on the second surface of the pattern-etched chip substrate, the quantum circuit to form the quantum chip.
    Type: Application
    Filed: August 14, 2023
    Publication date: December 28, 2023
    Inventors: Dengfeng LI, Wenlong ZHANG, Maochun DAI, Kunliang BU, Sainan HUAI
  • Publication number: 20230320234
    Abstract: A method and device for preparing a Josephson junction are provided. The method includes: preparing a photoresist film layer comprising an undercut structure on a substrate, the undercut structure comprising a first strip-shaped opening and a second strip-shaped opening; performing, at a first angle, evaporation on the photoresist film layer obliquely to the substrate, to prepare a first strip-shaped superconducting layer through the first strip-shaped opening; and performing, at a second angle, evaporation on the photoresist film layer obliquely to the substrate, to prepare a second strip-shaped superconducting layer through the second strip-shaped opening, the first strip-shaped superconducting layer and the second strip-shaped superconducting layer crossing each other, and an intersection of the first strip-shaped superconducting layer and the second strip-shaped superconducting layer being isolated by an oxidation layer to form a Josephson junction.
    Type: Application
    Filed: May 26, 2023
    Publication date: October 5, 2023
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Kunliang BU, Wenlong ZHANG, Dengfeng LI
  • Publication number: 20230307293
    Abstract: Disclosed are a silicon wafer and a method for filling a silicon via thereof, and belong to the field of superconducting quantum technologies. The method includes: obtaining a silicon wafer including at least one silicon via; providing a superconducting material on at least one side of the silicon wafer, the at least one side comprising a side where an opening of the silicon via is located; and heating and pressurizing the superconducting material to fill the superconducting material into the silicon via.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Dengfeng LI, Wenlong ZHANG
  • Publication number: 20230307297
    Abstract: A through silicon via interconnection structure and a method of forming same, and a quantum computing device are provided. The method includes: providing a silicon wafer, having a first surface and a second surface opposite to each other; forming, in the silicon wafer, a through silicon via penetrating through the silicon wafer in a direction from the first surface to the second surface of the silicon wafer; forming a groove communicating with the through silicon via in a target surface of the first surface and the second surface of the silicon wafer using a photolithography process; and forming a superconducting thin film in the groove and the through silicon via to obtain the through silicon via interconnection structure.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 28, 2023
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Dengfeng LI, Wenlong ZHANG, Kunliang BU
  • Publication number: 20230296963
    Abstract: An ultrasonic piezoelectric motor includes a frame, a carrier, and a Z-direction piezoelectric driver. The carrier is disposed on an inner side of the frame and moveable in a Z direction relative to the frame, the carrier is configured to receive a camera lens, and the Z direction is parallel to an optical axis of the camera lens. A Z-direction piezoelectric driver is located between the frame and the carrier. The ultrasonic piezoelectric motor periodically abuts against the carrier using the Z-direction piezoelectric driver and drives the carrier to move in the Z direction to focus a camera module.
    Type: Application
    Filed: August 3, 2021
    Publication date: September 21, 2023
    Inventors: Dengfeng Li, Yingyong He, Xinxiu Bian, Zhaoyuan Ding
  • Publication number: 20230197572
    Abstract: The present disclosure discloses a through-silicon-via structure and a method for preparing the same, a through-silicon-via interconnection structure and a method for preparing the same, and an electronic device, and belongs to the technical of semiconductors. The method includes forming an initial through hole running through a silicon-based substrate, forming a silicon oxide film on an inner wall of the initial through hole through oxidization, and removing the silicon oxide film to obtain a through-silicon-via structure with a through-silicon-via. The inner wall of the initial through hole will gradually tend to be smooth after being oxidized to form the silicon oxide film with a certain thickness, so that the inner wall of the through-silicon-via of the through-silicon-via structure formed after the silicon oxide film is removed is relatively smooth, which will not affect the quality of the conducting material subsequently grown on the inner wall of the through-silicon-via.
    Type: Application
    Filed: February 2, 2023
    Publication date: June 22, 2023
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Weiwen ZHENG, Kanglin XIONG, Jiagui FENG, Xiaowei LI, Wenlong ZHANG, Kunliang BU, Dengfeng LI
  • Publication number: 20230099146
    Abstract: This application discloses a coating method for making a chip. The method includes: fixing a substrate on a base. The substrate includes a hole. The method includes controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating material to be greater than 0 degrees and less than 90 degrees. The method includes controlling the substrate to rotate with respect to an axis perpendicular to the plane on which the substrate is located. The method includes during the rotation of the substrate, controlling the coating material to enter the hole along the deposition direction such that the coating material is deposited on a sidewall of the hole.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 30, 2023
    Inventors: Dengfeng LI, Wenlong ZHANG, Kunliang BU, Maochun DAI, Yarui ZHENG
  • Publication number: 20230007176
    Abstract: A camera system includes a module frame, a camera lens, an image sensor, and an SMA motor that are stacked within the module frame. The camera lens is fixedly connected to the module frame, and the SMA motor is located on an out-light side of the camera lens. The image sensor is located between the camera lens and the SMA motor and is fastened to the SMA motor. The SMA motor is configured to actuate the image sensor to shift in a direction parallel to an optical axis of the camera lens. The SMA motor is further configured to actuate the image sensor to shift on a plane perpendicular to the optical axis of the camera lens.
    Type: Application
    Filed: November 11, 2020
    Publication date: January 5, 2023
    Inventors: Gang Wang, Xin Li, Wei Tang, Dengfeng Li
  • Publication number: 20220345021
    Abstract: Disclosed are a motor (20, 40, 50, 60, 70, 80), a camera module (100), and a mobile terminal (200). A motor (20, 40, 50, 60, 70, 80) includes a base (21, 41, 51, 61, 71, 81), a support base (23, 43, 53, 63, 73, 83), and a shape memory alloy actuator (25). The shape memory alloy actuator (25) is fixedly connected between the base (21, 41, 51, 61, 71, 81) and the support base (23, 43, 53, 63, 73, 83), and the shape memory alloy actuator (25) is configured to drive the support base (23, 43, 53, 63, 73, 83) to move relative to the base (21, 41, 51, 61, 71, 81).
    Type: Application
    Filed: October 15, 2020
    Publication date: October 27, 2022
    Inventors: Ran Duan, Yingyong He, Haibo Wan, Dengfeng Li
  • Publication number: 20220252896
    Abstract: An elastomer includes an elastomer body and at least one elastomer cantilever. The elastomer cantilever is coupled to the elastomer body and extends along an outer edge of the elastomer body, the at least one elastomer cantilever is coupled to the fastener at a predetermined position of an extending part, and the at least one elastomer cantilever is axisymmetric or 90° rotationally symmetric.
    Type: Application
    Filed: May 9, 2020
    Publication date: August 11, 2022
    Inventors: Ran Duan, Haibo Wan, Qian Mei, Dalin Lv, Dengfeng Li
  • Publication number: 20220187615
    Abstract: A voice coil motor for driving a liquid lens and a lens assembly having a voice coil motor, where the voice coil motor includes a plurality of sub motor parts. The sub motor parts can be independently controlled. The sub motor part includes an unmovable part, a movable part, which can move along an optical axis direction relative to the unmovable part, a connection elastic piece, coupled to the liquid lens and the movable part, where when a force is applied to the movable part in the optical axis direction, the movable part drives the connection elastic piece to squeeze the liquid lens.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 16, 2022
    Inventors: Taihong Xia, Chuan Yang, Jianwen Wang, Haixia Jiang, Lei Jiang, Dengfeng Li, Yuandao Ju