Patents by Inventor Denis Mayer

Denis Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6560123
    Abstract: An assembly for mechanically mounting and providing electrical connections to overcurrent protection devices having first and second male power plugs includes a non-conductive main structural support member having a plurality of plug passageways formed therein and one or more load busbar modules mounted thereon and also including a plug passageway formed therein, to enable the male electrical plugs to mate with sockets disposed in a conductive line busbar member mounted on said support member and with a socket disposed in a load busbar member included in each load busbar module. Each load busbar module includes a non-conductive housing and a releasable cover within which is mounted the load busbar member. A printed circuit board substrate is preferably also mounted to said support member to provide a support surface for auxiliary signal clip connectors disposed on one side of the substrate.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: May 6, 2003
    Assignee: Astec International Limited
    Inventors: Christian de Varennes, Imad Ghanem, Rejean Lafontaine, Denis Mayer
  • Patent number: 6530811
    Abstract: An assembly for mechanically mounting and providing electrical connections to overcurrent protection devices having first and second male power plugs includes a non-conductive main structural support member having a plurality of plug passageways formed therein and one or more load busbar modules mounted thereon and also including a plug passageway formed therein, to enable the male electrical plugs to mate with sockets disposed in a conductive line busbar member mounted on said support member and with a socket disposed in a load busbar member included in each load busbar module. Each load busbar module includes a non-conductive housing and a releasable cover within which is mounted the load busbar member. A printed circuit board substrate is preferably also mounted to said support member to provide a support surface for auxiliary signal clip connectors disposed on one side of the substrate.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: March 11, 2003
    Assignee: Astec International Limited
    Inventors: Michael Padulo, Imad Ghanem, Denis Mayer