Patents by Inventor Denise M. Shimazu

Denise M. Shimazu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Co-cured vacuum-assisted resin transfer molding manufacturing method
    Patent number: 7419627
    Abstract: According to one embodiment of the invention, a co-cured vacuum-assisted resin transfer molding manufacturing method includes providing a tool base, disposing a prepreg skin panel outwardly from the tool base, disposing one or more tooling details outwardly from the prepreg skin panel, and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium between the one or more tooling details and the one or more preforms, enclosing the prepreg skin panel, the one or more tooling details, the one or more preforms, and the high permeability medium with at least one vacuum bag, pulling a vacuum on the vacuum bag, infusing the one or more preforms with a resin, and curing the one or more preforms and the prepreg skin panel.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: September 2, 2008
    Assignee: Northrop Grumman Corporation
    Inventors: Chi Hsien Sheu, Denise M. Shimazu, David Michael Kane
  • Co-cured resin transfer molding manufacturing method
    Patent number: 7374715
    Abstract: According to one embodiment of the invention, a co-cured resin transfer molding manufacturing method includes providing a tool having one or more tooling details and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium outwardly from the one or more tooling details, disposing a prepreg skin panel outwardly from the high permeability medium, disposing the one or more tooling details and the prepreg skin panel within the tool, injecting a resin into the one or more preforms, and curing the one or more preforms and the prepreg skin panel.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: May 20, 2008
    Assignee: Northrop Grumman Corporation
    Inventors: Christopher H. Husmann, Chi H. Sheu, Denise M. Shimazu
  • Co-cured vacuum-assisted resin transfer molding manufacturing method
    Publication number: 20040051214
    Abstract: According to one embodiment of the invention, a co-cured vacuum-assisted resin transfer molding manufacturing method includes providing a tool base, disposing a prepreg skin panel outwardly from the tool base, disposing one or more tooling details outwardly from the prepreg skin panel, and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium between the one or more tooling details and the one or more preforms, enclosing the prepreg skin panel, the one or more tooling details, the one or more preforms, and the high permeability medium with at least one vacuum bag, pulling a vacuum on the vacuum bag, infusing the one or more preforms with a resin, and curing the one or more preforms and the prepreg skin panel.
    Type: Application
    Filed: September 13, 2002
    Publication date: March 18, 2004
    Applicant: Northrop Grumman Corporation
    Inventors: Chi Hsien Sheu, Denise M. Shimazu, David Michael Kane
  • Co-cured resin transfer molding manufacturing method
    Publication number: 20030218267
    Abstract: According to one embodiment of the invention, a co-cured resin transfer molding manufacturing method includes providing a tool having one or more tooling details and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium outwardly from the one or more tooling details, disposing a prepreg skin panel outwardly from the high permeability medium, disposing the one or more tooling details and the prepreg skin panel within the tool, injecting a resin into the one or more preforms, and curing the one or more preforms and the prepreg skin panel.
    Type: Application
    Filed: May 22, 2002
    Publication date: November 27, 2003
    Applicant: Northrop Grumman Corporation
    Inventors: Christopher H. Husmann, Chi H. Sheu, Denise M. Shimazu